Processing and Properties of IM7/PETI Composites

Hou, Tan-Hung; Jensen, Brian J.; Hergenrother, P. M.

doi:10.1177/002199839603000107

Cited by 93 publications

(70 citation statements)

References 7 publications

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“…During the HSR, a molding cycle that includes 250°C/1 hr B-stage and 371°C/1 hr with 200 psi consolidation was successfully designed for the IM7/PETAA-5/NMP prepreg system. Void-free laminates with sizes up to 12" x 12" and 24 plies were fabricated with very good mechanical properties reported [7]. For these small parts, the imidization and (minimal, if any) crosslinking reactions occurring in the PETAA-5/NMP matrix during the 250°C/1 hr B-staging period did not compromise matrix resin processability to an unacceptable level.…”

Section: Introductionmentioning

confidence: 88%

“…PETAA-5/NMP resin was taken from wet prepreg flash and thermally pre-treated at 250°C/1 hr in an oven before measurement. An earlier study reported that less than 0.5% w/w volatiles remained after the 250°C/1 hr thermal pre-treatment [7]. Because of the presence of reinforcing fibers, prepreg viscosities (in Figure 1b)) were artificially inflated about two orders of magnitude when compared to the neat resin viscosity.…”

Section: Mechanical Measurementsmentioning

confidence: 95%

“…It displayed an attractive combination of properties demanded by the HSCT both as adhesive and composite matrix [1][2][3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…solvent NMP at a theoretical number average molecular weight of~5,000 g/mol [2][3][4][5][6][7]. Two batches of IM7/PETAA-5/NMP prepreg were used in this study.…”

Section: Introductionmentioning

confidence: 99%

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Processing robustness for a phenylethynyl‐terminated polyimide composite

Hou

2006

J of Applied Polymer Sci

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The processability of a phenylethynyl terminated imide resin matrix (designated as PETI -5) composite is investigated. IM7/PETAA-5/NMP prepreg is more sensitive to consolidation temperature than to pressure. A good consolidation is achievable at 371°C (700°F)/100 Psi, which yields an RT OHC strength of 62 Ksi. However, processability declines dramatically at temperatures below 350°C (662°F), as evidenced by the OHC strength values. The processability of the IM7/ LARC TM PETI-5 prepreg was found to be robust.

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Section: Introductionmentioning

confidence: 88%

Section: Mechanical Measurementsmentioning

confidence: 95%

“…It displayed an attractive combination of properties demanded by the HSCT both as adhesive and composite matrix [1][2][3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…solvent NMP at a theoretical number average molecular weight of~5,000 g/mol [2][3][4][5][6][7]. Two batches of IM7/PETAA-5/NMP prepreg were used in this study.…”

Section: Introductionmentioning

confidence: 99%

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Processing robustness for a phenylethynyl‐terminated polyimide composite

Hou

2006

J of Applied Polymer Sci

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“…The extent of imidization can be determined from the heights of the absorption bands for imides I and III, terminated imide oligomers for high-temperature aerospace and aircraft applications, known as phenylethynyl-terminated imide (LaRC PETI), were developed at the National Aeronautics and Space Administration (NASA) Langley Research Center, USA [13][14][15][16][17][18][19]. These materials have broader processing windows and thermal oxidative stability than simple ethynyl-terminated materials, and consequently have many practical advantages as a potential material for coatings, adhesives, films, and composite matrix resins [20,21].…”

Section: Phenylethynyl-terminated Imide Polymermentioning

confidence: 99%

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Cho

Drzal²

2016

Carbon letters

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In efforts to characterize and understand the properties and processing of phenylethynylterminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.Key words: polyimide, exfoliated graphite nanoplatelets, carbon fiber, composite, properties Phenylethynyl-Terminated Imide PolymerPolyimides have been extensively used in the electronics industry [1] as coatings, films, or adhesives and also in composite applications [2] as a primary or secondary structural material. When incorporated with organic or inorganic fibers, including carbon fibers and glass fibers, they can potentially be applied as a sizing material for high-temperature uses. In advanced applications, one of the most desirable advantages of polyimides, especially the aromatic polyimides, is their excellent high-temperature performance. Their thermal characteristics, including high temperature stability and cure behavior, are critical to successful processing and to the final properties of the resulting polyimide. For aerospace and aircraft applications, advanced polymer materials must successfully maintain their properties at high service temperatures over a long exposure time [3][4][5].The important parameters influencing the heat resistance of a polymeric material are its glass transition temperature (T g ), melting point (T m ), thermal stability, and etc., which may depend on its thermal history. Accordingly, polymers that are used to fulfill such high temperature performance should exhibit a high T g or T m and have excellent thermal stability. Even though some polyimides meet the high temperature requirement, their uses have been limited due to processing difficulties, such as poor solubility in common solvents, the release of volatiles, brittleness, and high processing temperature [6,7].Aromatic polyimides, especially acetylene or ethynyl-terminated polyimides, have been extensiv...

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Characterization, properties, and processing of LaRC PETI-5 as a high-temperature sizing material. II. Thermal characterization

Cho

Drzal

2000

J. Appl. Polym. Sci.

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In this publication the glass transition, melting behavior, cure behavior, and thermal stability of LaRC PETI-5 have been extensively studied utilizing differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The material used here was subjected to different thermal history (cumulative cure and individual cure) including an isothermal cure. The extent of cure for the partially cured resin was evaluated taking into account the residual solvent in the resin with the aid of a correction factor. The data show that the thermal history for the imidization reaction may influence the extent of cure for the partially cured LaRC PETI-5. The reaction of the C'C bonds in the phenylethynyl groups located in the imide polymer chain ends is completed to produce a fully cured LaRC PETI-5 within 1 h at 350°C in air. The result is very consistent with the result obtained using Fourier Transform infrared (FT-IR) spectroscopy in the previous work. This study also demonstrates that no reaction takes place above 350°C prior to degradation. LaRC PETI-5 with a molecular weight of 2500 g/mol has excellent thermal stability up to 550°C as long as it is fully imidized. The result of the isothermal stability suggests that this material may be used without significant loss of its integrity for extended periods of time below 450°C.

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Processing and Properties of IM7/PETI Composites

Cited by 93 publications

References 7 publications

Processing robustness for a phenylethynyl‐terminated polyimide composite

Processing robustness for a phenylethynyl‐terminated polyimide composite

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Characterization, properties, and processing of LaRC PETI-5 as a high-temperature sizing material. II. Thermal characterization

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