2018
DOI: 10.3166/acsm.42.541-550
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Processing and characterisation of LM30 alloy + graphite reinforced composite through gravity and centrifugal casting

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“…In fact, bond breakage is commonplace in many popular iron-carbon alloys, nickel-based alloys and titanium alloys. After cutting stainless steel and other materials with cemented carbide tools, some scholars pointed out that the element diffusion of congeners will bond the chips with the rake face and the loss of tungsten will reduce the hardness of tool material, leading to bond breakage [1][2][3][4]; In addition, they also conducted a series of diffusion experiments, established the theoretical model of element diffusion in the tool, and determine the damage threshold. Through the cutting of 508III steel with cemented carbide tools, Cheng et al [5] identified the bonding layer formed on the tool-chip interface, under the action of force-thermal coupling field, as the fundamental cause of bond breakage, and concluded that bond breakage of cemented carbide tools is a shared problem in the cutting of various chip materials.…”
Section: Introductionmentioning
confidence: 99%
“…In fact, bond breakage is commonplace in many popular iron-carbon alloys, nickel-based alloys and titanium alloys. After cutting stainless steel and other materials with cemented carbide tools, some scholars pointed out that the element diffusion of congeners will bond the chips with the rake face and the loss of tungsten will reduce the hardness of tool material, leading to bond breakage [1][2][3][4]; In addition, they also conducted a series of diffusion experiments, established the theoretical model of element diffusion in the tool, and determine the damage threshold. Through the cutting of 508III steel with cemented carbide tools, Cheng et al [5] identified the bonding layer formed on the tool-chip interface, under the action of force-thermal coupling field, as the fundamental cause of bond breakage, and concluded that bond breakage of cemented carbide tools is a shared problem in the cutting of various chip materials.…”
Section: Introductionmentioning
confidence: 99%