Process optimization of doping conditions for (100) P-type monocrystalline silicon solar cell using response surface methodology

Abstract

The effect of time and temperature on the sheet resistance (R S ) and carrier concentration (N A ) of (100) P-type monocrystalline Si was investigated. Phosphorus-doped n þ -emitters were fabricated through solid-source doping in a quartz tube furnace. The process variable values for 13 runs were proposed by response surface methodology (RSM). The optimized values for time and temperature predicted by RSM were 56 min and 1045°C, respectively, for a sheet resistance of 41.7 Ω∕□ and a carrier concentration of 3.7E18 cm −3 . Optimization-based fabrication was found to be in close agreement with the optimized values. Parameter optimization using RSM could be valuable in achieving predetermined dopant variables in optoelectronic devices as well as in reducing the surface recombinations and series resistance of highly efficient Si solar cells. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline. , and Mat Jafri: Process optimization of doping conditions for (100) P-type monocrystalline.

Study on Surface Texturization of Monocrystalline Silicon Wafers with Na2CO3 and NaHCO3 Solutions

“…Experimental Process. Monocrystalline silicon wafers of P-type <100> orientation with a resistivity of 2 Ω-4 Ω. cm were used for this work [9]. The size of the wafers was quasi-squared 15 mm × 15 mm which cut from the 125 mm × 125 mm.…”