2010
DOI: 10.1117/12.846313
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Process optimization consideration for 193nm developable bottom anti-reflective coatings (DBARCs)

Abstract: Developable BARCs (DBARCs) are useful for implant layers because they eliminate the plasma etch step avoiding damage to the plasma sensitive layers during implantation. It is expected that DBARC will also be used for non-implant layers and double exposure technology. AZ has pioneered DBARC based on photosensitive cleave as well as crosslink/decrosslink mechanisms. In this paper, we focus on various processing factors for 193nm DBARC and discuss the influences of prewet, thickness, topography and substrates on … Show more

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“…Photosensitive DBARCs have photoimageable properties and resolve patterns irrespective of upper resist layer [9][10][11][12][13][14][15][16][17][18]. Therefore, they have better resolution and through-pitch performance which are required for logic devices and critical layers.…”
mentioning
confidence: 99%
“…Photosensitive DBARCs have photoimageable properties and resolve patterns irrespective of upper resist layer [9][10][11][12][13][14][15][16][17][18]. Therefore, they have better resolution and through-pitch performance which are required for logic devices and critical layers.…”
mentioning
confidence: 99%
“…[7][8][9][10] In these cases, interest in DBARC technology is typically driven by cost of ownership (COO) concerns. Again the ability to retain reflection control but eliminate the ARC open etch step is appealing from the standpoint of lowering COO The attributes outlined above suggest DBARC technology is well suited to address many of today's advanced patterning needs.…”
mentioning
confidence: 99%
“…[8][9][10][11][12][13][14] In addition to research by material vendors, several device makers have and continue to evaluate DBARC technology as the search for a production worthy DBARC continues.…”
mentioning
confidence: 99%