2017
DOI: 10.1016/j.mee.2017.01.016
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Process induced poling and plasma induced damage of thin film PZT

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Cited by 7 publications
(1 citation statement)
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“…Another widely used method for platinum and PZT etching is ion milling, which is still used in the most recent reported literature [21]. This physical etching is not selective to photoresist, leaves a rough surface after etching, and damages the PZT layer [22]. Rough surfaces cause a misalignment in the next lithography step and hence not suitable for feature-size sensitive devices.…”
Section: Introductionmentioning
confidence: 99%
“…Another widely used method for platinum and PZT etching is ion milling, which is still used in the most recent reported literature [21]. This physical etching is not selective to photoresist, leaves a rough surface after etching, and damages the PZT layer [22]. Rough surfaces cause a misalignment in the next lithography step and hence not suitable for feature-size sensitive devices.…”
Section: Introductionmentioning
confidence: 99%