2012 IEEE International Conference on Electron Devices and Solid State Circuit (EDSSC) 2012
DOI: 10.1109/edssc.2012.6482808
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Process-induced charge trapping and junction breakdown instability in deep trench isolation for high voltage Smart Power IC process

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“…It has been reported that BVdss walkout (BVdss increase) is observed after either repeated BVdss measurements [1][2][3] or hot-carrier stress [4], leading to BVdss instability. Previous literatures [1][2][3][4] mentioned that the physical mechanism leading to BVdss walkout is the reduced local electric field near the breakdown point. Such a field reduction is caused by avalanche breakdown or hot-carrier-induced injected oxide charge or interface states (N IT ).…”
mentioning
confidence: 99%
“…It has been reported that BVdss walkout (BVdss increase) is observed after either repeated BVdss measurements [1][2][3] or hot-carrier stress [4], leading to BVdss instability. Previous literatures [1][2][3][4] mentioned that the physical mechanism leading to BVdss walkout is the reduced local electric field near the breakdown point. Such a field reduction is caused by avalanche breakdown or hot-carrier-induced injected oxide charge or interface states (N IT ).…”
mentioning
confidence: 99%