1993
DOI: 10.1016/0167-9317(93)90062-a
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Process enhancements for positive tone silylation

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Cited by 8 publications
(7 citation statements)
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“…However, in the same article, opposite effects for higher PAB conditions were observed when t-butoxycarbonyl groups were used as inhibitor groups. The values of residual solvent are lower by more than an order of magnitude than those reported by Beauchemin, Ebersole, and Daraktchiev, 19 who obtained values of 2-4 wt % PGMEA in 1 m films of pure novolac at 120°C and 20 Thus, the PAB of 118°C used here was 50°C above T g . Unfortunately, the effect of physical properties as discussed by Paniez et al 22 could affect photoacid diffusion during the PEB and may be confounded with residual solvent correlations.…”
Section: B Resist Componentscontrasting
confidence: 52%
“…However, in the same article, opposite effects for higher PAB conditions were observed when t-butoxycarbonyl groups were used as inhibitor groups. The values of residual solvent are lower by more than an order of magnitude than those reported by Beauchemin, Ebersole, and Daraktchiev, 19 who obtained values of 2-4 wt % PGMEA in 1 m films of pure novolac at 120°C and 20 Thus, the PAB of 118°C used here was 50°C above T g . Unfortunately, the effect of physical properties as discussed by Paniez et al 22 could affect photoacid diffusion during the PEB and may be confounded with residual solvent correlations.…”
Section: B Resist Componentscontrasting
confidence: 52%
“…However, concerns have been raised about the flow and pattern deformation of patterns silylated with HMDS or other monofunctional agents, since the T g of such materials is close to room temperature. 36,37 We have thus undertaken a detailed thermal study of the photoresist system after each processing step, using DSC and TMA. In the TMA method a pressure is exercised on the surface of the film with a probe, and its penetration is measured as a function of temperature.…”
Section: Thermal Characterizationmentioning
confidence: 99%
“…17,18 At the beginning of the PEB when the film is not a glass, the methanol could easily have this high a diffusion coefficient. Because there is very little methanol left within the film after PEB, an average methanol molecule created in the last few seconds of the PEB near the resist-wafer interface would need to diffuse to the top of the film and evaporate within a few seconds.…”
Section: A Chemical Modification Of Resistmentioning
confidence: 99%