2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023
DOI: 10.1109/eptc59621.2023.10457623
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Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration

Xiangyu Wang,
Mihai Dragos Rotaru,
Yu Haitao
et al.
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