Process and characterization of ultra-thin film packages

Kuo, Tzu-Ying; Hsiao, Zhi-Cheng; Hung, Yin-Po; Li, Wei; Chen, Kuo-Chyuan; Hsu, Chung-Yi; Ko, Cheng-Ta; Chen, Yuhua

doi:10.1109/impact.2010.5699606

Cited by 4 publications

(2 citation statements)

References 6 publications

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“…Direct embedding of chips in flexible PCB [15] or of thin chips in foil [16], [17] appears as the most straightforward way to realize HySiF (Fig. 6a).…”

Section: Ultra-thin Chip Embeddingmentioning

confidence: 99%

“…Also, the metallization schemes of PCB and chip technologies are incompatible unless contact pads on chip receive a suitable noble metal capping [15]. Chips can either be embedded face-up [16] or face-down by means of solder-bump flip-chip assembly [17]. In all cases contact pads are needed, which may limit the input/output (I/O) count or increase the chip area.…”

Section: Ultra-thin Chip Embeddingmentioning

confidence: 99%

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Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

Burghartz

Alavi

Albrecht

et al. 2019

IEEE J. Electron Devices Soc.

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This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic component implementation are combined in a complementary fashion in and on a flexible carrier substrate. HySiF paves the way to entirely new applications of electronic products where form factor, form adaptivity and form flexibility are key enablers. In this review paper the various aspects of thin-chip fabrication and embedding, device and circuit design under impact of unknown or variable mechanical stress, and the on-and off-chip implementation of sensor, actuator, microwave, and energy supply components are addressed. INDEX TERMS Hybrid integrated circuits, thin film circuits, flexible electronics, micro assembly, multichip modules, chip scale packaging.

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“…Direct embedding of chips in flexible PCB [15] or of thin chips in foil [16], [17] appears as the most straightforward way to realize HySiF (Fig. 6a).…”

Section: Ultra-thin Chip Embeddingmentioning

confidence: 99%