2014
DOI: 10.1002/2013gl058671
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Probing the slip‐weakening mechanism of earthquakes with electrical conductivity: Rapid transition from asperity contact to gouge comminution

Abstract: Despite the great importance of slip weakening during earthquakes, the fault-weakening mechanism inside the fault remains to be clarified. Here we propose a micromechanism of slip weakening at seismic and subseismic slip rates as demonstrated by electrical conductivity observation across the fault. At the seismic slip rate, the formation of melt patches and the subsequent growth to molten layer during frictional melting were confirmed by the rapid increases in conductivity in two stages. At the subseismic slip… Show more

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Cited by 13 publications
(16 citation statements)
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References 29 publications
(54 reference statements)
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“…In contrast, the transmitted wave amplitudes are related to the distribution of voids that become scatterers of the elastic waves. Therefore, the observations by Yamashita et al (2014) are complementary to those in the present study. At this moment, unfortunately, we could not measure the transmitted waves and electric conductivity simultaneously in the same experiment because of the electric isolation issue.…”
Section: Discussionsupporting
confidence: 81%
See 1 more Smart Citation
“…In contrast, the transmitted wave amplitudes are related to the distribution of voids that become scatterers of the elastic waves. Therefore, the observations by Yamashita et al (2014) are complementary to those in the present study. At this moment, unfortunately, we could not measure the transmitted waves and electric conductivity simultaneously in the same experiment because of the electric isolation issue.…”
Section: Discussionsupporting
confidence: 81%
“…Recently, Yamashita et al (2014) measured electric conductivity across the sliding interface during high slip velocity friction experiments. They showed apparent temporal correlation between conductivity and friction coefficient during the experiment.…”
Section: Discussionmentioning
confidence: 99%
“…The melt patches as small as ~5 µm might be the product of flash heating at elevated temperatures (Figures c and S4), and the larger ones (~100–200 µm in size) might have formed by the growth of smaller ones. The melt patch formation and growth appear to be correlated with fault strengthening (Figure ) [ Hirose and Shimamoto , ; Kim et al ., ; Otsuki et al ., ; Yamashita et al ., ]. Further bulk temperature increases during the strengthening may lead to the formation of a melt layer (Figure e) and, consequently, fault weakening (or melt lubrication) [e.g., Hirose and Shimamoto , ; Nielsen et al ., ].…”
Section: Discussionmentioning
confidence: 99%
“…Such instabilities are often observed in laboratory experiments [1][2][3][4][5][6][7][8][9]. At much larger scales, these instabilities may explain how aftershocks can be triggered by acoustic waves from earthquakes elsewhere [10][11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 90%