2023
DOI: 10.3390/ma16062497
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Probing the Interplay between Mo Back Contact Layer Deposition Condition and MoSe2 Layer Formation at the CIGSe/Mo Hetero-Interface

Abstract: The effect of Mo thin film deposition power in DC sputtering on the formation of a MoSe2 interfacial layer grown via the annealing of CIGSe/Mo precursors in an Se-free atmosphere was investigated. A Mo layer was deposited on glass substrates using the DC magnetron sputtering method. Its electrical resistivity, as well as its morphological, structural, and adhesion characteristics, were analyzed regarding the deposition power. In the case of thinner films of about 300 nm deposited at 80 W, smaller grains and a … Show more

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Cited by 4 publications
(2 citation statements)
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“…On the other hand, sputtering technology is one of the eco-friendly processing methods that does not use water, and it has the advantage of being relatively convenient and can easily apply metals on the sample, so it is used in various mechanical parts and semiconductors. Additionally, researches related to sputtering technology include solid surfaces by ion-impact, hazard, transportation parts, solar absorbers, tunable optical properties, sensors, implants, batteries and etc [12][13][14][15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, sputtering technology is one of the eco-friendly processing methods that does not use water, and it has the advantage of being relatively convenient and can easily apply metals on the sample, so it is used in various mechanical parts and semiconductors. Additionally, researches related to sputtering technology include solid surfaces by ion-impact, hazard, transportation parts, solar absorbers, tunable optical properties, sensors, implants, batteries and etc [12][13][14][15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, researches related to sputtering technology include solid surfaces by ion impact, hazard, transportation parts, solar absorbers, tunable optical properties, sensors, implants, batteries, etc. [12][13][14][15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%