Abstract:Transition metal dichalcogenides (TMDs) are a group of layered 2D semiconductors that have shown many intriguing electrical and optical properties. However, the thermal transport properties in TMDs are not well understood due to the challenges in characterizing anisotropic thermal conductivity. Here, a variable-spot-size time-domain thermoreflectance approach is developed to simultaneously measure both the in-plane and the through-plane thermal conductivity of four kinds of layered TMDs (MoS , WS , MoSe , and … Show more
“…where T T and B T denote the temperatures of top and bottom nanoribbons, respectively. These equations are similar to the two-temperature model [31][32][33][34] and the two-channel thermal transport model [35]. Eq.…”
Understanding thermal transport through nanoscale van der Waals interfaces is vital for addressing thermal management challenges in nanoelectronic devices. In this work, the interfacial thermal conductance ( CA G ) between copper phthalocyanine (CuPc) nanoribbons is reported to be on the order of 10 5 Wm -2 K -1 at 300 K, which is over two orders of magnitude lower than the value predicted by molecular dynamics (MD) simulations for a perfectly smooth interface between two parallelly aligned CuPc nanoribbons. Further MD simulations and contact mechanics analysis reveal that surface roughness can significantly reduce the adhesion energy and effective contact area between CuPc nanoribbons, and thus result in an ultralow CA G . In addition, the adhesion energy at the interface also depends on the stacking configuration of two CuPc nanoribbons, which may also contribute to the observed ultralow CA G .
“…where T T and B T denote the temperatures of top and bottom nanoribbons, respectively. These equations are similar to the two-temperature model [31][32][33][34] and the two-channel thermal transport model [35]. Eq.…”
Understanding thermal transport through nanoscale van der Waals interfaces is vital for addressing thermal management challenges in nanoelectronic devices. In this work, the interfacial thermal conductance ( CA G ) between copper phthalocyanine (CuPc) nanoribbons is reported to be on the order of 10 5 Wm -2 K -1 at 300 K, which is over two orders of magnitude lower than the value predicted by molecular dynamics (MD) simulations for a perfectly smooth interface between two parallelly aligned CuPc nanoribbons. Further MD simulations and contact mechanics analysis reveal that surface roughness can significantly reduce the adhesion energy and effective contact area between CuPc nanoribbons, and thus result in an ultralow CA G . In addition, the adhesion energy at the interface also depends on the stacking configuration of two CuPc nanoribbons, which may also contribute to the observed ultralow CA G .
“…MJm -3 K -1 , the average sound velocity of cross-plane acoustic modes 16 ~2400 ms -1 , and the crossplane bulk conductivity 3,17 ~2 to 5 Wm -1 K -1 , gives a MFP of around 1.5 to 4 nm, which corresponds to a thickness of 2 to 6 layers. A similar calculation for graphite gives a gray MFP estimate of around 3 nm, corresponding to 9 layers.…”
Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. Conventionally, it is thought that cross-plane thermal conductivities (κz) are low, and therefore c-axis phonon mean free paths (MFPs) are small. Here, we measure across MoS2 films of varying thickness (20 to 240 nm) and uncover evidence of very long c-axis phonon MFPs at room temperature in these layered semiconductors. Experimental data obtained using time-domain thermoreflectance (TDTR) are in good agreement with first-principles density functional theory (DFT).These calculations suggest that ~50% of the heat is carried by phonons with MFP >200 nm, exceeding kinetic theory estimates by nearly two orders of magnitude. Because of quasi-ballistic effects, the κz of nanometer-thin films of MoS2 scales with their thickness and the volumetric thermal resistance asymptotes to a non-zero value, ~10 m 2 KGW -1 . This contributes as much as 30% to the total thermal resistance of a 20 nm thick film, the rest being limited by thermal interface resistance with the SiO2 substrate and top-side aluminum transducer. These findings are essential for understanding heat flow across nanometer-thin films of MoS2 for optoelectronic and thermoelectric applications.
“…25 For example, could be first measured using a large spot radius at a high modulation frequency 0 (as shown in Figure 1b), then can be measured using a small spot radius at a low modulation frequency (as shown in Figure 1c). However, we need to be cautious that the measured could depend on 0 when different phonon modes are out of thermal equilibrium [26][27][28][29][30][31] and could be underestimated if 0 is smaller than the mean free paths of heat carrying phonons. 29, 32-34 We perform the following measurements to make sure that the measured thermal conductivity of SiC samples is intrinsic and is not affected by the choices of operation parameters such as the laser spot radius or the modulation frequency.…”
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confidence: 99%
“…We extended the error propagation formula by Yang et al 37 in our previous work for the case when multiple modulation frequencies are used. 31 The error propagation formula is written as:…”
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confidence: 99%
“…The uncertainties (2 ) of the control parameters are estimated as follows: 10% for the thermal conductivity of Al, 5% for the heat capacity of Al and the substrate, 5% for the Al thickness, and 4% for the laser spot size. 23,31 We summarize the calculated 4 ⋅ [ ] for the SI 4H-SiC, n-type 4H-SiC and SI 6H-SiC in Table 1, so that the uncertainties 2 can be directly calculated as square root of the diagonal elements. The SI and n-type 4H-SiC have higher and than those of SI 6H-SiC sample, which agree well with the first principles predictions that the thermal conductivity of H-SiC ( = 2, 4, 6)…”
Silicon carbide (SiC) is a wide bandgap (WBG) semiconductor with promising applications in high-power and high-frequency electronics. Among its many useful properties, the high thermal conductivity is crucial. In this letter, the anisotropic thermal conductivity of three SiC samples, n-and SI 6H-SiC (V-doped 1×10 17 cm -3 ), is measured using femtosecond laser based time-domain thermoreflectance (TDTR) over a temperature range from 250 K to 450 K. We simultaneously measure the thermal conductivity parallel to ( ) and across the hexagonal plane ( ) for SiC by choosing the appropriate laser spot radius and the modulation frequency for the TDTR measurements. For both and , the following decreasing order of thermal conductivity value is observed: SI 4H-SiC > n-type 4H-SiC > SI 6H-SiC. This work serves as an important benchmark for understanding thermal transport in WBG semiconductors.
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