Probability-Based Analyses of the Snap-Through in Cage-Shaped Mesostructures Under Out-of-Plane Compressions

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

“…Among the various promising directions of the vibrant field, 3D flexible electronics represent a core branch, owing to their unique structure-induced functionalities, expanded design freedoms, and capabilities of better conforming to or replicating complexly shaped biological objects, when compared with planar counterparts. Compatible with well-established fabrication techniques of planar inorganic flexible electronics, ,, mechanically-guided 3D assembly methods stand as powerful tools for the manufacturing of architected 3D flexible electronics with precisely engineered structural configurations and functionalities. , Though the primary goal of mechanically-guided assembly methods (i.e., rolling, folding, curving and buckling) is to manufacture miniaturized flexible electronic devices from nano- to millimeter-scale, many examples have showcased that the mechanically-guided assembly methods, such as the rolling, folding and buckling, are capable of parallel manufacturing of multiple devices/systems/structures in one round. ,,, Notably, herein, to establish a clear material–fabrication–performance–application relationship, a detailed comparison table (Table ) summarizing the used assembly methods, device forms, structure-induced functionalities, superiorities comparing to their planar counterparts, and applications of various architected 3D flexible devices is presented. Despite significant progress summarized above, rich opportunities exist in this burgeoning area of architected 3D flexible electronics, as detailed below.…”

“… 138 , 300 Though the primary goal of mechanically-guided assembly methods (i.e., rolling, folding, curving and buckling) is to manufacture miniaturized flexible electronic devices from nano- to millimeter-scale, many examples have showcased that the mechanically-guided assembly methods, such as the rolling, folding and buckling, are capable of parallel manufacturing of multiple devices/systems/structures in one round. 96 , 119 , 249 , 444 Notably, herein, to establish a clear material–fabrication–performance–application relationship, a detailed comparison table ( Table 2 ) summarizing the used assembly methods, device forms, structure-induced functionalities, superiorities comparing to their planar counterparts, and applications of various architected 3D flexible devices is presented. Despite significant progress summarized above, rich opportunities exist in this burgeoning area of architected 3D flexible electronics, as detailed below.…”