Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies

London, Springer-Verlag; Fricano, D.; Dasgupta, Abhijit; Reinikaininen, T.; Freitas, Gustavo José da Costa; Pagliosa, Cleber

doi:10.1109/esime.2009.4938418

Cited by 1 publication

(1 citation statement)

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“…This technological progress is known with the electronic feature size shrinking and the density growth. In parallel to this spectacular development, the undesired electromagnetic compatibility (EMC) effects [2][3][4][5] and the different environmental effects [6][7][8][9][10][11][12][13][14][15] such as the humidity and the thermal influence become more and more unavoidable. Therefore, these physical aspects should be considered during the design and the fabrication of modern electric-and electronic-circuits.…”

Section: Introductionmentioning

confidence: 99%

Thermal Effect Modeling on Passive Circuits With MLP Neural Network for Emc Application

Bensetti¹,

Duval²,

Ravelo³

2011

PIER M

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During the last two decades, several simulation tools have been proposed for the modeling of electronic equipments in function of the physical environmental changes. It was stated that numerous electronic components such as semiconductor devices can be affected by the mechanistic effects, humidity or simply the temperature variations. To study the last effect, based on the multilayer perceptron neural network (MLPNN), a characterization method of the passive electronic device thermal effects is introduced in this paper. The method proposed was realized toward the equivalent circuit identification of the under test device (R, L, C components) measured input impedances. To demonstrate the relevance of the method, numerical computations with MLPNN algorithms implemented into Matlab were performed. First, a capacitor modeling from 30 kHz to 1 GHz for the temperature variation from 25 • C to 130 • C is presented. It was found that a good agreement between the proposed model and the measurement is observed. Then, a commercial EMI low-pass filter was also characterized in RF frequencies through the S-parameter identification. Finally, further discussion on the potential applications of this work, in particular, in the electromagnetic compatibility (EMC) field is offered in the last part of this paper.

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