Printing Crack‐Free Microporous Structures by Combining Additive Manufacturing with Colloidal Assembly

Abstract

strategies. [4] Here, on-chip microfluidics could aid to effectively remove heat. [4] This requires processing techniques with great design and material flexibility. However, current processes for microfluidics rely mainly on lithography techniques, which are limited in materials selection and restricted to rather 2D designs. [5] Hence, the development of novel processing routes is required that allow design flexible processes such as AM and greater materials variety. [4] Next to thermal management in highpower electronics, thermal shielding in high-temperature applications requires consistent enhancement toward higher working temperatures: here, next-generation reflective thermal barrier coatings (rTBCs) with tailored microstructures have lower thermal conductivity in comparison to traditional TBCs, [6] but most importantly are capable of additionally scatter heat radiation. [7] The emittance of heat radiation scales with temperature by T 4 , hence obstructing radiative heat transport becomes very relevant with increasing working temperatures (>1000 °C). Therefore, coating components for high-temperature applications with such rTBCs could allow the devices to work at higher operating temperatures.

Photon Management Enabled by Opal and Inverse Opal Photonic Crystals: from Photocatalysis to Photoluminescence Regulation

“…developed uniform single line and macroscale area printing of colloidal suspensions using the direct writing process. At the same time, by tailoring parameters for the colloidal particle concentrations and printing velocities, the coffee ring formation can be prevented [145] …”

“…At the same time, by tailoring parameters for the colloidal particle concentrations and printing velocities, the coffee ring formation can be prevented. [145]…”