Printed circuit board technology inspired stretchable circuits

Vanfleteren, Jan; González, Mario; Bossuyt, Frederick; Hsu, Yu‐I; Vervust, Thomas; Wolf, Ingrid De; Jabłoński, M

doi:10.1557/mrs.2012.48

Cited by 130 publications

(109 citation statements)

References 17 publications

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“…7(c). To match the mechanical properties of the rigid components and the stretchable conductor, an island structure is often used to release the strain on the island in order to protect the rigid components [3,49,50]. Here, an island structure made of porous paper was embedded in the PU matrix by a simple thermal pressing step to Nano Res.…”

Section: Resultsmentioning

confidence: 99%

“…2016, 9(2): 401-414 found in areas including large area electronics, wearable devices, sensors, light emitting diodes (LEDs), and batteries [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. To accommodate large mechanical deformations during stretching while maintaining the electrical performance and stability of the system, either the materials themselves or the structures need to be stretchable [1].…”

Section: Introductionmentioning

confidence: 99%

“…To accommodate large mechanical deformations during stretching while maintaining the electrical performance and stability of the system, either the materials themselves or the structures need to be stretchable [1]. The traditional approach to this problem has been to engineer non-stretchable conductors into novel shapes, followed by encapsulation in an elastic material to achieve stretchable performance, which requires optimized conductor design and precise patterning [1][2][3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

et al. 2016

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Silver nanowires (AgNWs) have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNWbased components has been hampered by complex and time-consuming steps. Here, we introduce a facile, fast, and one-step methodology for the fabrication of highly conductive and stretchable AgNW/polyurethane (PU) composite electrodes based on a high-intensity pulsed light (HIPL) technique. HIPL simultaneously improved wire-wire junction conductivity and wire-substrate adhesion at room temperature and in air within 50 μs, omitting the complex transfer-curing-implanting process. Owing to the localized deformation of PU at interfaces with AgNWs, embedding of the nanowires was rapidly carried out without substantial substrate damage. The resulting electrode retained a low sheet resistance (high electrical conductivity) of <10 Ω/sq even under 100% strain, or after 1,000 continuous stretching-relaxation cycles, with a peak strain of 60%. The fabricated electrode has found immediate application as a sensor for motion detection. Furthermore, based on our electrode, a light emitting diode (LED) driven by integrated stretchable AgNW conductors has been fabricated. In conclusion, our present fabrication approach is fast, simple, scalable, and costefficient, making it a good candidate for a future roll-to-roll process.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

et al. 2016

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“…As such, the first experiments are started using available film materials and applying these materials by lamination. From the Cmst research on stretchable electronics [8], a number of thermoplastic polyurethane (TPU) films are available in varying thickness. A selection of these films, namely Epurex Platilon U2102, U4201 and U073, are subjected to the IPC-TM-650-2.3.17.1b flow test (Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films).…”

Section: Figure 5 Process Flow For Double-sided Chip Embeddingmentioning

confidence: 99%

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Cauwe

Vandecasteele

Baets

et al. 2012

2012 4th Electronic System-Integration Technology Conference

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Expanding the current smart packaging solutions to individual products requires improvement for several of the following properties: cost, thickness, weight, flexibility, conformability, transparency, and even stretchability. This paper focusses on an embedding technology that targets the first four properties, with an emphasis on cost reduction. The progress on the development work for this foil-based embedding is reported, along with a detailed failure analysis of the process flow. A functional demonstrator is realized in the form of a smart sensing label, including an embedded micro controller. Practical and technological shortcomings of the current technology are used as a starting point for proposing an improved embedding technology based on lowcost plastic materials. The first developments for lamination and via interconnection are described.

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“…10,11 Rigid component islands are distributed on the surface of an elastomeric substrate and interconnected with elastic wiring. This hard-onsoft integration however suffers from large mechanical strain concentration at the interface between the rigid (printed circuit board PCB-like) islands and the stretchable substrate.…”

Section: Introductionmentioning

confidence: 99%

Hybrid stretchable circuits on silicone substrate

Robinson

Aziz

Liu

et al. 2014

Journal of Applied Physics

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When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate-a silicone matrix carrying concentric rigid disks-ensures both the circuit elasticity and the mechanical integrity of the most fragile materials. V C 2014 AIP Publishing LLC. [http://dx

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Printed circuit board technology inspired stretchable circuits

Abstract: Abstract

Cited by 130 publications

References 17 publications

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Hybrid stretchable circuits on silicone substrate

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