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Conformal thin film sensing represents a cutting-edge technology capable of precisely measuring complex surface temperature fields under extreme conditions. However, fabricating high-temperature-resistant conformal thin film thermocouple arrays remains challenging. This study reports a method for manufacturing conformal thin film thermocouple arrays on metal spherical surfaces using a printable paste composed of silicates and Ag. Specifically, the use of silicate glass phases enhances the high-temperature performance of the silver printable paste, enabling the silver ink coatings to withstand temperatures up to 947 °C and survive over 25 h at 900 °C. The thermocouples, connected to Pt thin films, exhibited a Seebeck coefficient of approximately 17 μV/°C. As a proof of concept, an array of six Ag/Pt thin film thermocouples was successfully fabricated on a metal spherical surface. Compared to traditional wire-type thermocouples, the conformal thin film thermocouple arrays more accurately reflect temperature variations at different points on a spherical surface. The Ag/Pt conformal thin film thermocouple arrays hold promise for monitoring temperature fields in harsh environments, such as aerospace and nuclear energy applications.
Conformal thin film sensing represents a cutting-edge technology capable of precisely measuring complex surface temperature fields under extreme conditions. However, fabricating high-temperature-resistant conformal thin film thermocouple arrays remains challenging. This study reports a method for manufacturing conformal thin film thermocouple arrays on metal spherical surfaces using a printable paste composed of silicates and Ag. Specifically, the use of silicate glass phases enhances the high-temperature performance of the silver printable paste, enabling the silver ink coatings to withstand temperatures up to 947 °C and survive over 25 h at 900 °C. The thermocouples, connected to Pt thin films, exhibited a Seebeck coefficient of approximately 17 μV/°C. As a proof of concept, an array of six Ag/Pt thin film thermocouples was successfully fabricated on a metal spherical surface. Compared to traditional wire-type thermocouples, the conformal thin film thermocouple arrays more accurately reflect temperature variations at different points on a spherical surface. The Ag/Pt conformal thin film thermocouple arrays hold promise for monitoring temperature fields in harsh environments, such as aerospace and nuclear energy applications.
Direct ink writing (DIW) of high-temperature thin-film sensors holds significant potential for monitoring extreme environments. However, existing high-temperature inks face a trade-off between cost and performance. This study proposes a SiCN/RuO2/TiB2 composite ceramic ink. The added TiB2, after annealing in a high-temperature atmospheric environment, forms B2O3 glass, which synergizes with the SiO2 glass phase formed from the SiCN precursor to effectively encapsulate RuO2 particles. This enhances the film’s density and adhesion to the substrate, preventing RuO2 volatilization at high temperatures. Additionally, the high conductivity of TiB2 improves the film’s overall conductivity. Test results indicate that the SiCN/RuO2/TiB2 film exhibits high linearity from room temperature to 900 °C, high stability (resistance drift rate of 0.1%/h at 800 °C), and high conductivity (4410 S/m). As a proof of concept, temperature sensors and a heat flux sensor were successfully fabricated on a metallic hemispherical surface. Performance tests in extreme environments using high-power lasers and flame guns verified that the conformal thin-film sensor can accurately measure spherical temperature and heat flux, with a heat flux sensor response time of 53 ms. In conclusion, the SiCN/RuO2/TiB2 composite ceramic ink developed in this study offers a high-performance and cost-effective solution for high-temperature conformal thin-film sensors in extreme environments.
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