2021
DOI: 10.1103/physrevmaterials.5.114603
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Primary radiation damage in silicon from the viewpoint of a machine learning interatomic potential

Abstract: Characterization of the primary damage is the starting point in describing and predicting the irradiation-induced damage in materials. So far, primary damage has been described by traditional interatomic potentials in molecular dynamics simulations. Here, we employ a Gaussian approximation machine-learning potential (GAP) to study the primary damage in silicon with close to ab initio precision level. We report detailed analysis of cascade simulations derived from our modified Si GAP, which has already shown it… Show more

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Cited by 5 publications
(6 citation statements)
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“…Hamedani et al 112 used an ML interaction potential to conduct an MD study on the radiation damage and sputtering of Si. The utilized ML potential, specifically the Gaussian approximation potential (GAP), 113 was originally trained to equilibrium properties and, hence, complemented with a DFT repulsive potential (i.e., DMol 114 ) for short range interactions to resolve the evolution of the collision cascade accurately.…”
Section: Physical Sputteringmentioning
confidence: 99%
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“…Hamedani et al 112 used an ML interaction potential to conduct an MD study on the radiation damage and sputtering of Si. The utilized ML potential, specifically the Gaussian approximation potential (GAP), 113 was originally trained to equilibrium properties and, hence, complemented with a DFT repulsive potential (i.e., DMol 114 ) for short range interactions to resolve the evolution of the collision cascade accurately.…”
Section: Physical Sputteringmentioning
confidence: 99%
“…For example, the Ziegler-Biersack-Littmark potential 214 and all-electron DFT repulsive potential, DMol, have been merged with ML interaction potentials (e.g., GAP), which were trained to equilibrium properties, to account for screened nuclear repulsion during high-energy collisions when radiating Si or Al. 112,117,215,216 Caro et al 217,218 conducted MD simulations with the GAP to study the ion beam deposition of C thin films. Studying a complementary sputter deposition can be readily achieved by introducing Ar þ ions to the process, whose interactions are sufficiently well described by traditional means.…”
Section: Plasma-surface Interactionmentioning
confidence: 99%
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“…However, technological operations of the manufacturing of electronic devices [17][18][19], operating under extreme external fields [20][21][22][23][24], can stimulate the creation of defect complexes based on point defects (e.g., vacancies and interstitial silicon atoms) [25][26][27] and their further interaction and clustering [28,29].…”
Section: Introductionmentioning
confidence: 99%
“…Разом з тим, технологічні операції виготовлення електронних пристроїв [10,11], експлуатація в екстремальних зовнішніх полях [12] можуть стимулювати створення внутрішніх дефектних комплексів на онові власних точкових дефектів (вакансій та міжвузлових атомів кремнію) [13] та їх подальшу взаємодію з дислокаціями та кластеризацію [14].…”
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