Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens

Abstract

The paper presents extended creep properties of eutectic SnAg3.8Cu0.7 solder using dog bone shaped tensile specimen to extend the data for the Alpha-Omega Model. The tensile test machine was carefully modified with respect of solder material requirements in terms of stress free specimen mounting and assurances of high stable stress conditions. Furthermore the tensile tester is able to measure the deformation of the specimen directly on the specimen, which allows more precise tests and more independence from temperature and stress dependent tester parts like the clamping and the rods. The tests were performed in three temperatures: 25degC, 75degC and 125degC and three different stresses at each temperature

Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

“…Because of the low melting point of SnAgCu alloys, around 220 • C, room temperature corresponds to 0.6 Tm (in Kelvin). Consequently, SnAgCu alloys present a time-dependent behaviour at room temperature and the effects of strain rate and stress relaxation cannot be neglected [17][18][19][20][21][22].…”

Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder

“…5 were measured with an in-house developed micro tensile tester machine. The tester configuration and the procedure of the specimen preparation were detailed described in [13]. The main advantage of this particular tester is a reliable test setup for long time measurements at very low strain rates (> 10-10 S -I ) combined with a stress free specimen clamping.…”