Pressureless sintering behavior and properties of Ag–SnO2

Desplats, Henri; Brisson, Elodie; Rogeon, Philippe; Carré, Patrick; Bonhomme, Alexandre

doi:10.1007/s12598-017-0961-2

Cited by 8 publications

(4 citation statements)

References 27 publications

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“…An understanding of the underlying mechanisms of metal NP sintering is necessary in the fields of electric packaging and manufacturing [ 8 , 22 , 53 , 62 , 63 , 64 , 65 , 66 , 67 , 68 , 69 , 70 ]. The sintering process of Ag NPs has been discussed using the classical sphere-sphere model [ 71 ], and the relationship between the mechanical properties and microstructures was investigated.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

“…This type of high-performance bonding material is suitable for both high- and low-temperature bonding environments and has broad application prospects. At present, the bonding material is often used for devices in high-temperature environments and broadband gap semiconductor devices [ 62 , 65 , 66 , 67 , 81 ]. Therefore, it is interesting to study the high-temperature properties of joints utilizing polyol-based Ag NP paste.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

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A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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“…However, the relative density of the sample with relatively higher weight Ag percent is much higher than that of the other sample. As known, various phenomena such as creep and plastic flow are responsible for the densification of the powder compacts during the sintering process [22,31]. The mentioned mechanisms are accelerated by increasing the SPS temperature.…”

Section: Microstructure and Mechanical Properties Of The Sintered Sammentioning

confidence: 99%

“…In the mentioned processes Ag and the reinforcement powders or their oxides or nitrides such as Ag 2 O, ZnO, and AgNO 3 have been used as starting materials for the synthesis of composite powders [15][16][17][18][19][20][21]. The conventional methods for densification of Ag containing powders are hot press (HP), pressureless, and spark plasma sintering (SPS) processes [22][23][24]. SPS is a rapid and low-temperature densification method that has been used for the consolidation of metallic, ceramic, and composite powders [25,26].…”

Section: Introductionmentioning

confidence: 99%

Sinterability and characterization of Ag/Al2O3 metal and ceramic matrix composites processed by mechanical milling

2020

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In this research, the sinterability of Ag/Al2O3 milled powders with 10 and 90 wt%Ag were investigated. The powders were consolidated by two different processes including conventional and spark plasma sintering. The conventionally sintered composites with 90 wt%Ag were further densified by cold pressing and subsequent annealing at 700?C. The microstructural evaluations confirmed a fine dispersion of the constituents within the microstructure of the spark plasma sintered composites. Moreover, the results showed that the relative density, hardness, and flexural strength of the spark plasma sintered samples were much higher than those of the other samples. The hardness and flexural strength of Ag/10 wt%Al2O3 spark plasma sintered samples at 650?C were 146 HV and 264 MPa, respectively. However, unlike the composite with 90 wt%Ag, the applied sintering temperatures have not led to the synthesis of an Ag/90 wt% Al2O3 composite with the desired properties

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Effect of temperature on electrical and thermal conductivities of powder compacts: Ag-C and Ag-WC

et al. 2022

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Pressureless sintering behavior and properties of Ag–SnO2

Cited by 8 publications

References 27 publications

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Sinterability and characterization of Ag/Al2O3 metal and ceramic matrix composites processed by mechanical milling

Effect of temperature on electrical and thermal conductivities of powder compacts: Ag-C and Ag-WC

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