Preparation of three-dimensional ceramic substrate by multiple electroforming for UV-LED hermetic packaging

Yang, Zizhou; Sun, Qinglei; Cheng, Hao; Liu, Xingxing; Peng, Yang

doi:10.1016/j.ceramint.2019.07.218

Cited by 14 publications

(7 citation statements)

References 30 publications

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“…Nonreactive wetting was realized at a low temperature with no IMCs at this interface. However, in the traditional brazing of ceramic and metal, many IMC layers were produced at the wetting interface via reactive wetting, 10,16 which required a high temperature to realize the decomposition of ceramic.…”

Section: Resultsmentioning

confidence: 99%

“…Various bonding methods for Cu and ceramic, such as direct bonding copper, 1,7,14,15 direct plating copper, 8,16 active metal bonding, 10,12 and laser activation metallization 9,17 which limits the current carrying capacity. In direct plating copper technology, the ceramic is first surface modified by vacuum sputtering, and then electro-plated Cu is made on the ceramic via chemical bonding at a low temperature of ∼300 • C. 8 The thickness of Cu is limited to below 1 mm for a low plating rate of several µm/h.…”

Section: Introductionmentioning

confidence: 99%

“…In laser activation metallization technology, texturing patterns are first created using a laser, and electroless-plated Cu is then manufactured on the ceramic surface via redox reaction at room temperature. The thickness of Cu is only tens of micrometers in 1.5 h. 16 The use of a laser also inevitably increases the equipment cost. In summary, making a thick Cu layer on ceramics through direct bonding copper, direct plating copper, active metal bonding, and laser activation metallization technologies is difficult.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Chen,

Xu,

et al. 2023

J Am Ceram Soc.

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The bonding of thick Cu and AlN is necessary in power modules with the development of high–frequency communication technology. In this work, 2 mm – thick Cu was successfully bonded with AlN by using Sn9Zn solder with the assistance of ultrasonication at 230°C. Results showed that an AlN/Sn9Zn/Cu joint without crack was manufactured with a cooling rate of 7°C/min. Nonreactive wetting was realized between AlN and Sn9Zn, forming an amorphous transition layer. CuZn2 and CuZn were formed at the Sn9Zn/Cu interface. A joint with the highest bonding strength of 30.07 MPa was obtained, in which the AlN/Sn9Zn interface was no longer the weakest location. This work provides a low–temperature manufacturing method for thick Cu/AlN joints.This article is protected by copyright. All rights reserved

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Chen,

Xu,

et al. 2023

J Am Ceram Soc.

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show abstract

“…In addition, the voids were inevitable in the Cu layer due to the sintering process, which was also a disadvantage [21]. Besides these methods, the DPC substrates were widely applied as heat dissipation substrate due to theirs high metal pattern precision, excellent thermal performance, and low manufacturing temperature [11,22]. Nevertheless, the Cu layer was easy to delaminated at a relatively high temperature due to the weak bonding strength of van der Waals forces [22].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Song

Chen

Wang

et al. 2023

Preprint

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In this work, an innovative and cost-effect method was proposed to fabricate AlN/Cu composite structure. The AlN ceramic was metallized by nanosecond laser irradiation without consuming extra materials. The metallurgical combination between AlN ceramic and Cu was successfully achieved based on the Al-Cu eutectic reaction at a relatively low temperature of 620 ℃. Under the laser irradiation, the AlN ceramic was thermal decomposed to form Al laeyer and microgroove. As the laser power increased, more Al was produced on the the ceramic surface and the micgroove became deeper. The microstructure, mechanical and heat transfer properties of the AlN/Cu joints were investigated. The maximum shear strength of the joint was 11.25MPa when the laser power was 56 W, and the maximum thermal conductivity was 162 W/(m·K) when the laser power was 42 W. The approach of laser-induced direct metallization of ceramics in this work provides a novel strategy for the integration of ceramics/metals composite structures.

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Thermal enhancement of optical-thermal-electrical isolation package structure for UVA LEDs

Yuan,

Liu,

et al. 2024

Applied Thermal Engineering

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Preparation of three-dimensional ceramic substrate by multiple electroforming for UV-LED hermetic packaging

Cited by 14 publications

References 30 publications

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Thermal enhancement of optical-thermal-electrical isolation package structure for UVA LEDs

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