2010
DOI: 10.1021/jp9114755
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Preparation of Sol−Gel Films by Dip-Coating in Extreme Conditions

Abstract: Dip-coating of sol-gel solutions is a complex dynamic process that is difficult to model because it is associated with time-dependent evaporation-induced concentration and viscosity gradients in the solution. It is, however, highly used in the coating technology because it is simple and provides excellent reproducibility. Existing fair models have been proposed some decades ago to describe this method, but they are based on Newtonian and nonevaporating liquids and require several important assumptions and simp… Show more

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Cited by 256 publications
(309 citation statements)
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“…24 Depending on the withdrawing speed, three deposition regimes can be observed: the capillary, the draining or a combination of both regimes. 25 The capillary regime is observed for very slow withdrawing speeds (<0.1 mm/s) and is associated with the capillary rise in the formed solid film. The draining regime, on the contrary, dominates at high withdrawing speeds (> 1mm/s) due to quick dragging of the viscous fluid.…”
Section: Introductionmentioning
confidence: 99%
“…24 Depending on the withdrawing speed, three deposition regimes can be observed: the capillary, the draining or a combination of both regimes. 25 The capillary regime is observed for very slow withdrawing speeds (<0.1 mm/s) and is associated with the capillary rise in the formed solid film. The draining regime, on the contrary, dominates at high withdrawing speeds (> 1mm/s) due to quick dragging of the viscous fluid.…”
Section: Introductionmentioning
confidence: 99%
“…This correlation is reported in ) in the so-called "capillary regime". [13] The periodicity of the parallel crack can be tuned from 47 down to 2μm by increasing the withdrawal speed from 0.02 to 1 mms -1 respectively (at room temperature). According with the literature [7][8] the crack periodicity is proportional to the film's thickness; this correlation was verified here, with a periodicity/thickness ratio equal to 3.5 for deposition on silicon wafers ( Figure S6).…”
mentioning
confidence: 99%
“…Previous studies by Faustini et al 71 have shown that experimental conditions are critical during dip-coating, and in particular the withdrawal speed (ws): at very low and very high ws, 0.01 mm s À1 and 10 mm s À1 respectively, the thickness of the film was supposed to be the highest, while a speed in the range 0.1-0.5 mm s À1 should help to achieve the thinnest film deposition. Initial experiments were performed at 25 1C with a relative humidity of 25% and a ws of 1 mm s À1 .…”
Section: Effect Of Ph On Sophorolipid Surface Assemblymentioning
confidence: 99%
“…At a very low speed (0.01 mm s À1 ), the film formation was ruled by the capillary regime wherein solvent evaporation was faster than the motion of the drying line. 71 The film was then thick and the molecules could adopt less energetic organization on the surface. On the contrary, at high withdrawal speed (10 mm s À1 ), the film formation was governed by the draining regime.…”
Section: Effect Of Ph On Sophorolipid Surface Assemblymentioning
confidence: 99%
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