2015
DOI: 10.15376/biores.10.3.5586-5595
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Preparation of Nitrogen-containing Activated Carbon from Waste Medium Density Fiberboard for Electric Double Layer Capacitor

Abstract: The waste of medium density fiberboards was carbonized at a temperature of 500 °C. The activated carbons were obtained after 16 h of impregnation and 1 h of activation by KOH at 800 °C with KOH/coke mass ratios of 2.5, 3.0, 3.5, and 4.0. The activated carbons were investigated for determination of porosity and elemental analysis. The results showed that the surface area of the activated carbons varied from 1456 to 1647 m 2 /g and the total pore volume ranged from 0.701 to 1.106 cm 3 /g, which was affected by d… Show more

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Cited by 2 publications
(2 citation statements)
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“…Factors affecting the physicochemical property of the composite include type of substrate and strain, incubation time, and fabrication process. 69-400 (l) 60-550 (c) 3450 (k) Water absorption (%) 200 (b) 6.9 (a) 52 (f ) 12 (k) Recyclability Fully degradable (h) Decades, century (h) Years, decades (h) None (g) Raw materials Mycelium and organic wastes or substrates (i) Polymers and natural gases (a) Adhesives, sawdust, and chips (j) Cement and sand (k) Manufacturing process Molding and growing (i) Polymerization and expansion (h) Lathing, pressing, resin infusion, and milling (h) Mixing, molding, and curing (k) a [32], b [85], c [86], d [49], e [87], f [7], g [13], h [4], i [88], j [89], k [47], and l [69].…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Factors affecting the physicochemical property of the composite include type of substrate and strain, incubation time, and fabrication process. 69-400 (l) 60-550 (c) 3450 (k) Water absorption (%) 200 (b) 6.9 (a) 52 (f ) 12 (k) Recyclability Fully degradable (h) Decades, century (h) Years, decades (h) None (g) Raw materials Mycelium and organic wastes or substrates (i) Polymers and natural gases (a) Adhesives, sawdust, and chips (j) Cement and sand (k) Manufacturing process Molding and growing (i) Polymerization and expansion (h) Lathing, pressing, resin infusion, and milling (h) Mixing, molding, and curing (k) a [32], b [85], c [86], d [49], e [87], f [7], g [13], h [4], i [88], j [89], k [47], and l [69].…”
Section: Discussionmentioning
confidence: 99%
“… a [ 32 ], b [ 85 ], c [ 86 ], d [ 49 ], e [ 87 ], f [ 7 ], g [ 13 ], h [ 4 ], i [ 88 ], j [ 89 ], k [ 47 ], and l [ 69 ]. …”
Section: Figureunclassified