2005
DOI: 10.1143/jjap.44.4098
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Preparation of Low-Stress SiNx Films by Catalytic Chemical Vapor Deposition at Low Temperatures

Abstract: This article covers acoustic design from two main aspects: the design of acoustical devices such as microphones, loudspeakers, etc, and the principles for reduction of sound through partitions, in rooms, etc. These sections are preceded by a description of the behaviour of sound waves and vibrating bodies, and an outline of human response to sound. Finally, special problems in silencing and in the diagnostic use of sound are described. Acoustic design principlesVector velocity of element of source Absorption c… Show more

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Cited by 14 publications
(8 citation statements)
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“…5 One may therefore consider the possibility that defect formation by electron irradiation is assisted by the stress induced by the SiN x film. In the present experiments, both front and back sides of an Si wafer were symmetrically covered by identical films for all SiN x /a-Si/c-Si stacked structures.…”
Section: Discussionmentioning
confidence: 99%
“…5 One may therefore consider the possibility that defect formation by electron irradiation is assisted by the stress induced by the SiN x film. In the present experiments, both front and back sides of an Si wafer were symmetrically covered by identical films for all SiN x /a-Si/c-Si stacked structures.…”
Section: Discussionmentioning
confidence: 99%
“…Passivating layers for organic light emitting diodes for example, require very low stress in the order of 10 MPa [10,11], in addition to low deposition temperatures. Low stress in thin films is also important in MEMS applications and plastic electronics.…”
Section: Silicon Nitride By Hot Wire Cvdmentioning
confidence: 99%
“…SiN x films deposited with conventional methods like PECVD tend to have high stress values in the range of 100-1000 MPa [45]. Passivating layers for organic light emitting diodes for example, require very low stress in the order of 10 MPa [46,47], in addition to low deposition temperatures. Low stress in thin films is also important in micro-electromechanical (MEMS) applications, plastic electronics and when TFTs are deposited on thin polymer foil.…”
Section: Mechanical Stress and Rms Roughness In Hw-sin Xmentioning
confidence: 99%