Preparation of Hydrophobic Low-k Epoxy Resins with High Adhesion Using a Benzocyclobutene-Rosin Modifier

Abstract

With the development of high-frequency communication, the miniaturization of integrated circuits (ICs) has led to interconnected signal delays and losses. The dielectric properties of epoxy resins are no longer satisfactory, because of the presence of polar groups. Herein, a benzocyclobutene-rosin modifier was designed and synthesized to reduce the dielectric constant of epoxy resins. The recross-linking network of benzocyclobutene inhibits the polarizability of the polar groups, and rosin skeletons increase the free volume of epoxy resins. Consequently, the dielectric constant of epoxy resins decreased from 3.12 to 2.72 and their water absorption decreased from 1.06% to 0.861%. The dielectric constant and water absorption are lower than those of most commercial dielectric materials. Additionally, the adhesion of epoxy resins was improved, which broke the contradiction between the dielectric properties and the adhesion of traditional epoxy resins. The modified epoxy resin was finally applied to printed circuit boards. At 15 GHz, its signal loss was 28.8 dB, which was lower than that of a commercial epoxy resin (FR-4), demonstrating that the modified epoxy resin can better meet the miniaturization needs of ICs.

Rosin-Modified Polyurethane Elastomers with Room-Temperature Self-Healing Ability, High Strength, and Recyclability Based on Oxime Dynamic Bonds

“…As mentioned earlier, BPU-0% AP and BPU-10% AP have about equal number of hydrogen bonds. The cause seems to be that the hydrogenated phenanthrene ring structure carried by the AP in the soft segment, improves the rigidity of the chain. , The rosin structure can increase the free volume of polymers, resulting in facilitated migration of the chain segments. ,− As shown in Figure a, BPU-10% AP could be stretched to 6 times the original length without break. Correspondingly, BPU-10% AP has the most excellent mechanical properties, whose strength, elongation at break, and toughness are 37.80 MPa, 628%, and 126.90 MJ m –3 respectively (Figures b and S6).…”

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

“…With the gradual increase in the informatization degree of military weapons, ultra‐low ε epoxy resins need to bear the high aerodynamic loading to ensure the normal and efficient operation of internal electronic components when the aircraft, missiles, and satellites are subjected to the large overload maneuvering or the orbital change (instantaneous acceleration of gravity up to 8 G or more) 57 . Presently, ultra‐low ε epoxy resins are mainly achieved by introducing the flexible chain segments into the molecular structures of epoxy monomers or curing agents.…”

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

“…However, conventional epoxy resins normally generate an unordered cross-linked network after curing, resulting in severe phonon scattering and thus a low inherent thermal conductivity of merely around 0.2 W/(m·K). , Additionally, very polar groups including hydroxyl, imide, or ester will be generated alongside the ring-opening of the epoxy group during curing, hence forming dipole or interfacial polarization. Thereby, the ε and tan δ will be increased, which in turn will cause the accumulation of heat to the substrate as tan δ corresponds to the amount of electrical energy converted to heat under an external electric field. , Meanwhile, it also leads to signal loss or distortion . Therefore, developing epoxy resins with both high intrinsic thermal conductivity and low dielectricity will further broaden their applications and promote the development of high-tech electronic products.…”

“… 17 , 18 Meanwhile, it also leads to signal loss or distortion. 19 Therefore, developing epoxy resins with both high intrinsic thermal conductivity and low dielectricity will further broaden their applications and promote the development of high-tech electronic products. Nevertheless, most of the reported studies only focus singly on either the intrinsic thermal conductivity or the dielectric properties as it is still a tough challenge to balance high intrinsic thermal conductivity and low dielectric constant and dielectric loss.…”