Preparation of Fully Aromatic Polysilarylenesiloxanes by Melt Polycondensation and Their Thermal Properties

Ichikawa, Hitoshi; Akiyama, Eiichi; Yu, Na; Yamamoto, Akiko; Fukui, Saburô

doi:10.1295/polymj.pj2006004

Cited by 8 publications

(6 citation statements)

References 20 publications

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“… and showed 529ºC and 523ºC of  d5 , respectively, and did excellent thermal stability similar to the fully aromatic polysilarylenesiloxanes in our previous [6,7]. Although  had experienced unexpected large weight loss during the meltpolycondensation, the TG curve of obtained  almost coincided with that of .…”

Section: Solubility Of Polymerssupporting

confidence: 55%

“…If perfect condensa tion reaction of  proceeded, the weight loss ratio was 3.2%. We had reported that meltpolyconden sation of a disilanol monomer proceeded with generating volatile compounds arising from deg radation [7]. The volatile compounds generated during the meltpolycondensation were trapped to analyze them by means of GCMS.…”

Section: Polysilarylenesiloxane () Prepared By Meltpolycondensationmentioning

confidence: 99%

“…In previous studies, we had reported fully aromatic polysilarylenesiloxane having tetra phenyldisiloxane units instead of tetramethyl disiloxane units, which showed high  m over 300ºC and no solubility in common solvents [6]. On the other hand, because of insoluble fully aromatic polysilarylenesiloxanes, meltpoly condensation of the corresponding disilanol monomers had be conducted to successfully prepare insoluble and amorphous films [7]. Soluble and fully aromatic polymer having short πconjugation length would be expected to apply to transparent and heatresistance material.…”

Section: Introductionmentioning

confidence: 99%

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Syntheses and Properties of Silicon-containing, Soluble and Fully Aromatic Polymers

Nishimura

Akiyama

2011

Trans. Mat. Res. Soc. Japan

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In order to obtain excellently heatresistant and transparent polymer materials, the fully aromatic polysilarylenesiloxanes were synthesized via the solution polymerization and the meltcondensation from the corresponding disilanol monomer. And the thermal properties of these polymers were investigated by using DSC and TGA. The polymer synthesized via the solution polymerization showed good solubility in various organic solvents, and 116ºC of glass transition temperature,  g , and 529ºC of 5% weight loss temperature,  d5 . On the other hand, the product obtained by the meltcondensation polymerization partially dissolved in organic solvent, and showed 93ºC of  g . Polyaryleneoxysiloxane was also prepared from 4,4'dihydroxytetraphenylmethane and dichlorodiphenylsilane, and showed 137ºC of  g , while polyaryleneoxysiloxane was easily hydrolyzed in homogeneous solution containing a base etc. 

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Section: Solubility Of Polymerssupporting

confidence: 55%

Section: Polysilarylenesiloxane () Prepared By Meltpolycondensationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Syntheses and Properties of Silicon-containing, Soluble and Fully Aromatic Polymers

Nishimura

Akiyama

2011

Trans. Mat. Res. Soc. Japan

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“…It would be caused by the elimination of the volatile organosilicon compound, such as a triphenyl silanol, from the chain-end as described in our previous report. 27 It was shown that the molecular weight of the copolymers also affected on the weight residues. On the other hand, the weight residues of CP-e and polyMS's were much smaller than the theoretical values.…”

Section: Thermal Properties Of Copolymersmentioning

confidence: 99%

Syntheses of Poly[(tetraphenyl-p-silphenylenesiloxane)-co-(tetramethyl-p-silphenylenesiloxane)]s and the Physical Properties of Their Films

Ichikawa

Akiyama

et al. 2007

Polym J

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ABSTRACT:In order to obtain a polysilarylenesiloxane having a high glass transition temperature (T g ), a high thermal degradation temperature (T d ), and a good solubility in common solvents to prepare a film, the copolycondensation of 1,4-bis(hydroxydiphenylsilyl)benzene with 1,4-bis(hydroxydimethylsilyl)benzene was studied. Their thermal properties were studied by using a differential scanning calorimetry and a thermogravimetry analysis. The physical properties of copolymer films were also investigated. All the copolymers exhibited the T g 's, and those increased with the increase of the molar ratio of the units based on 1,4-bis(hydroxydiphenylsilyl)benzene (PS units). The T g of one of the copolymers, CP-a, reached to 127 C. CP-c having a relatively high molecular weight showed the highest thermal stability in air, whose T d5 was 524 C. Tough self-standing films were obtained from the copolymers by the casting method. These films had much lower gas permeability coefficients than that of polydimethylsiloxanes and low surface energy similarly to the silicon-containing polymers having a phenylene moiety. The gas permeability coefficients of the films decreased, and the densities and the tensile strength of films increased with the increase of the molar ratio of PS units. These results indicated that dense and tough films were obtained from these copolymers.[doi:10.1295/polymj.PJ2006185] KEY WORDS Polysilarylenesiloxane / Thermal Degradation Temperature / Copolymerization / Glass Transition Temperature / Gas Permeability / Polysilarylenesiloxanes 1,2 and their copolymers [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] have been studied as high temperature elastomers whose degradation temperature (T d ) was greatly higher than that of polydimethylsiloxane (PDMS). Poly-(tetramethyl-p-silphenylenesiloxane) (polyMS) of a typical polysilarylenesiloxane was synthesized by Merker et al. 5 and their thermal properties were investigated. According to the literature, 3-5 polyMS shows a glass transition temperature (T g ) of À20C, a melting point (T m ) of 135 C and a thermal degradation temperature (T d ) of 370-390 C under helium flow. PolyMS/PDMS and polyMS/PDMS derivatives were synthesized and their thermal and physical properties were also reported. 2-19The common characteristics of these polyMS-containing polymers are their high T d and the low T g , which resulted from their flexible tetramethyldisiloxane units in the main chain. The mechanical strength of these polymers is not enough at high temperature to use as the heat-resistant materials such as a high-temperature coating and a low dielectric insulation material in semiconductor devices. Recently, Kawakami et al.,[20][21][22] reported the polymer derived from cardo-type 9,9 0 -bis[4-(dimethylsilyl)phenyl]-fluorene using a new method of the catalytic crossdehydrocoupling polymerization, and that this polymer exhibited high T g of 160 C, 22 however, the physical properties were not reported. We reported that the fully aromatic polysilarylenesilox...

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“…Silarylene-containing polymers, which exhibit a wide range of physical properties depending on their composition and structure, have received considerable academic and commercial interests over the past 30 years (11,12). One of the prominent properties of silarylene-containing polymers is their excellent thermal stability.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

Yang

Zhao

Zhang

et al. 2011

Journal of Macromolecular Science, Part A

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Two novel silphenylene-containing cycloaliphatic epoxy resins, 1,4-di [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (DEDSB) and 1,3,5-tri [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (TEDSB) were synthesized through in situ Grignard reaction and hydrosilylation, and characterized by FT-IR and 1 H-NMR. They were colorless transparent viscous liquids. Methyhexahydrophthalic anhydride (MeHHPA) was used to cure the epoxy resins to give glassy solids with high optical clarity. Differential scanning calorimetry (DSC) results indicated that DEDSB and TEDSB showed similar curing reactivity. The cured TEDSB had a higher glass transition temperature, a higher storage modulus and a lower coefficient of linear thermal expansion than the cured DEDSB due to a higher crosslink density. The cured silphenylene-containing epoxy resins exhibited a much higher resistance to discoloration under UV irradiation than the commonly used epoxy resins diglycidyl ether of bisphenol-A (DGEBA). XPS analysis revealed that they were much less susceptible to photo-oxidation than DGEBA.

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Preparation of Fully Aromatic Polysilarylenesiloxanes by Melt Polycondensation and Their Thermal Properties

Cited by 8 publications

References 20 publications

Syntheses and Properties of Silicon-containing, Soluble and Fully Aromatic Polymers

Syntheses and Properties of Silicon-containing, Soluble and Fully Aromatic Polymers

Syntheses of Poly[(tetraphenyl-p-silphenylenesiloxane)-co-(tetramethyl-p-silphenylenesiloxane)]s and the Physical Properties of Their Films

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

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