Preparation of Electroless-Plated NiReP Alloy Films for a Thin Film Resistor

Osaka, Tetsuya; Fukawa, Makoto; Kawaguchi, Jun

doi:10.5796/electrochemistry.60.523

Cited by 8 publications

(6 citation statements)

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“…13 Electroless deposition.-For the electroless deposition of NiWP and NiReP, the baths listed in Table II were employed. 7,8 To control the contents of W or Re in the electroless deposited films, the concentration of sodium citrate was varied in the range shown in the table. In the case of electroless deposition on SiO 2 , a commercial electroless NiP deposition bath ͑C.…”

Section: Methodsmentioning

confidence: 99%

“…In this paper, electroless Ni-ternary alloy films, such as NiWP 7 and NiReP, 8 are investigated with the aim of application to the barrier layer in interconnect technology. The thermal stability of electroless NiReP barrier fabricated on an SiO 2 surface covered with a self-assembled monolayer ͑SAM͒, [9][10][11][12][13] which was already reported by us in the previous article, 14 is also examined.…”

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Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology

Osaka

Takano

Kurokawa³

et al. 2002

J. Electrochem. Soc.

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Electroless NiWP and NiReP films were investigated with the aim of application to barrier and capping layers in interconnect technology. These alloys containing a refractory metal with a high melting point were expected to have the ability to avoid diffusion of Cu into the interlevel dielectric. The composition and resistivity of these films were investigated first in order to know the relation between the composition and its thermal stability. The thermal stability was investigated by measuring the sheet resistance and the cross-sectional observation with field emission scanning electron microscope. Additionally, an electroless Ni alloy deposition on the SiO 2 layer without a sputtered seed layer was also examined by utilizing a self-assembled monolayer ͑SAM͒ as an adhesion and catalytic layer. Since an alkaline solution damaged the SiO 2 surface, a two-step process, which consists of a nucleation step performed in an acid electroless deposition bath and a barrier layer formation step carried out in an alkaline bath, is employed in order to fabricate a consistently uniform barrier film on the SAM/SiO 2 surface. It was found that the NiReP films formed on SAM/SiO 2 surfaces were stable up to 400°C, and are feasible for the barrier layer for the Cu interconnect technology.

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Section: Methodsmentioning

confidence: 99%

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confidence: 99%

Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology

Osaka

Takano

Kurokawa³

et al. 2002

J. Electrochem. Soc.

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“…Electroless nickel-based alloys have been produced by adding cations or anionic complexes of the alloying elements into the normal electroless nickel bath [6]. Thus, electroless nickel-phosphorus alloys containing iron [7][8][9][10][11][12], rhenium [13][14][15][16][17][18][19][20], molybdenum [21][22][23][24][25][26], tungsten [27][28][29][30][31][32], zinc [14,33], tin [14,23,34], and copper [35][36][37] have been produced. Typical bath compositions for electroless nickelbased alloys are summarized in Table 22.1.…”

Section: Nickel-based Alloysmentioning

confidence: 99%

“…Nickel-Rhenium Alloys Electroless nickel-rheniumphosphorus alloys have been reported by several workers [13][14][15][16][17][18][19][20]. The alloys deposited contain a large amount of rhenium.…”

Section: Nickel-based Alloysmentioning

confidence: 99%

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Electroless Deposition of Alloys

Ohno

2010

Modern Electroplating

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Electroless metal deposits are mostly a binary alloy containing a metalloid such as phosphorous or boron which itself is a component of the reducing agent. Brenner and Riddel were the first to develop the process of electroless deposition of nickel-cobalt-phosphorus ternary alloy in 1946 [1]. At present, electroless alloy deposition is a practical and effective method for controlling the physicochemical properties of nickel-and cobalt-phosphorus deposits, thereby extending the range of application of electroless deposition. The recent tendency in this field is toward applications in the electronics industry. Despite an increasing number of publications concerning electroless alloy deposition, the details of its mechanisms are not clear yet.Electroless alloy deposition consists of several electrochemical partial reactions, such as cathodic deposition of the respective alloy components and the anodic oxidation of the reducing agent, although these partial reactions are not always independent of each another. Electroless metal deposition occurs under the condition that the oxidation potential of the reducing agent is less noble than the deposition potential of the metal. In case of alloy deposition, however, the deposition potential E * M of a constituent metal M in the alloy M-N shifts to a nobler potential by virtue of the negative Gibbs energy of the alloy formation DG M ; thuswhere DE M is the potential shift, E M the normal deposition potential of M, m the number of electrons, and F the Faraday constant. The potential shift DE M is of the order of 10 À2 V at most for solid-solution alloys, but sometimes it reaches up to 1 V in case of compound alloys. Therefore, it is possible to codeposit a metal that cannot be deposited otherwise as a pure metal [2]. Another requirement in electroless deposition is that the metal being deposited requires to have a catalytic activity for the anodic oxidation of the reducing agent [3]. In case of electroless alloy deposition, however, the catalytic activity depends in the last analysis on the composition of the depositing alloy. As shown in Figure 22.1, the rate of electroless nickel-iron alloy deposition using DMAB (dimethylamine borane) decreases with the increase of the iron content in the deposits. This behavior is attributable to the decrease in catalytic activity of the deposits for the anodic oxidation of DMAB, since iron is less active for this reaction than nickel [4,5]. ELECTROLESS ALLOY PLATING BATHS Nickel-Based AlloysElectroless nickel-based alloys have been produced by adding cations or anionic complexes of the alloying elements into the normal electroless nickel bath [6]. Thus, electroless nickel-phosphorus alloys containing iron [7-12], rhenium [13-20], molybdenum [21-26], tungsten [27-32], zinc [14, 33], tin [14, 23, 34], and copper [35-37] have been produced. Typical bath compositions for electroless nickelbased alloys are summarized in Table 22.1. Electroless nickel-cobalt alloys will be described in Section 22.1.2. Nickel-Iron Alloys Electroless nickel-iron-...

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