Preparation of Cu@Ag Nanoparticles for Conductive Ink

Abstract

In order to overcome the shortcomings of low-cost anti-oxidation conductive ink and its preparation method in the field of printing electronics, core-shell coated Cu@Ag nanoparticles were used to prepare conductive ink, and a printed circuit was obtained by inkjet printing. Copper nanoparticles were prepared by a chemical reduction method and then coated with Cu@Ag particles by a copper-based self-catalytic reaction. Conductive ink was prepared by ball milling and dispersion and printed on PI film to form a conductive coating. After characterization and analysis, the particle size and dispersion of the obtained Cu@Ag meet the requirements and can be stored stably under normal atmospheric conditions. The resistivity of the conductive film sintered at 300˚C is only 10.6 μΩ•cm.

Síntesis De Nanopartículas Cu-Ag Sobre Titanio Como Cátodo Para La Reducción Electroquímica De Nitrato en Soluciones Acuosas

“…Se sintetizó dos tipos de compósitos, el tipo Cu-Ag N1 correspondiente a la relación Ag:Cu (1:2) y el tipo Cu-Ag N2 correspondiente a la relación molar Ag:Cu (1:6). Finalmente se realizaron el lavado de nanopartículas mediante centrifugado 9,10 .…”

“…Las nanopartículas de Cu-Ag han sido estudiadas en diversas aplicaciones, para mejorar la actividad catalítica, buscando evitar la corrosión del Cu y estudiando diversas estructuras, como metales, óxidos, entre otros. Una de las técnicas empleadas para su preparación es el desplazamiento galvánico, ya que controla la cinética del transporte de masa 9,10 . Las técnicas sin electricidad requieren equipos menos costosos y tienen potencial para ser utilizadas a escala industrial 7,11 .…”

Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

“…Similar to Cu, Ag is also an interconnection material with high conductivity and high thermal conductivity. Cu/Ag composites are also often used in semiconductor packaging interconnection [ 9 ], printed circuits [ 10 ] and microvia filling [ 11 ]. Therefore, Ag is used as the pre-filling material in the experimental design of this paper, which meets the requirements of interconnect material performance in the microelectronic packaging process.…”