2011
DOI: 10.1016/j.surfcoat.2010.11.010
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Preparation of copper-coated β-SiC nanoparticles by electroless plating

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Cited by 54 publications
(23 citation statements)
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“…Such a defect-less bonding could not be observed in the microstructure of the previous samples. Many authors also reported that a strong bonding would be formed between ceramic particles and metal matrix if copper is coated on the surface of ceramic particles [30,31]. Line EDAX analysis for sample S4 indicated that white-colored areas are related to the presence of copper in the matrix of aluminum.…”
Section: Methodsmentioning
confidence: 98%
“…Such a defect-less bonding could not be observed in the microstructure of the previous samples. Many authors also reported that a strong bonding would be formed between ceramic particles and metal matrix if copper is coated on the surface of ceramic particles [30,31]. Line EDAX analysis for sample S4 indicated that white-colored areas are related to the presence of copper in the matrix of aluminum.…”
Section: Methodsmentioning
confidence: 98%
“…When the Al 2 O 3 particles after sensitization and activation were put into the plating solution, the copper (238) [7]. At the same time, the HCHO could react with OH since the pH value was maintained at pH 13 during the electroless plating procedure, as shown in Eq.…”
Section: Resultsmentioning
confidence: 99%
“…It has been established that adding certain Mg and Si elements in the aluminum system could be beneficial for the pressureless infiltration of the SiC preform by aluminum [7][8][9]. For instance, Choh and Oki [9] observed that the addition of Si to Al decreased the incubation period of wetting at temperatures between 1173 and 1373 K. The second method to increase the surface 2 Advances in Materials Science and Engineering energy of the particle surface involves pretreatment of the SiC particles with several surface coating technologies, such as the sol-gel method or high temperature oxidation to obtain silica coatings [10,11] by electroless plating [12,13]. Among the above techniques, electroless plating is considered more effective due to its low cost, easy-to-control procedure, and large-scale production abilities.…”
Section: Introductionmentioning
confidence: 99%