Preparation, curing properties, and phase morphology of epoxy-novolac resin/multiepoxy-terminated low-molecular-weight poly(phenylene oxide) blend

Wang, Huan; Mo, Jingzhao; Shentu, Baoqing; Wang, Zhixue

doi:10.1002/pen.23810

Cited by 6 publications

(2 citation statements)

References 23 publications

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“…3 Especially in a wide frequency range, PPE owns extremely low dielectric constant and dielectric loss, which makes it an excellent candidate material for electrical or electronic equipment, vehicle parts, business machines, adhesives, coatings and composites. 4,5 However, high-molecular-weight PPE has some shortcomings, such as poor process-ability, highmelt viscosity and low reactivity. Therefore, it needs to be reduced molecular weight to improve the compatibility and processing performance of polyphenylene ether materials with other resins.…”

Section: Introductionmentioning

confidence: 99%

“…It has the advantages of high heat resistance, high glass transition temperature and low water absorption, and so forth 3 . Especially in a wide frequency range, PPE owns extremely low dielectric constant and dielectric loss, which makes it an excellent candidate material for electrical or electronic equipment, vehicle parts, business machines, adhesives, coatings and composites 4,5 . However, high‐molecular‐ weight PPE has some shortcomings, such as poor process‐ability, high‐melt viscosity and low reactivity.…”

Section: Introductionmentioning

confidence: 99%

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Preparation and characterization of high temperature resistant thermosetting polyphenylene ether resin

et al. 2022

J of Applied Polymer Sci

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To explore high thermal properties, low dielectric constant and loss for copper clad laminates, poly(phenylene oxide) (PPE) with different end groups (allyl and epoxide groups) were successfully prepared. Firstly, low molecular weight polyphenylene ether was synthesized using the redistribution method. Then the polyphenylene ether thermosetting polymers by modifying their terminal hydroxyl groups were reported and their fundamental materials properties were compared. Through property tests and data analyses, it was found that PPE with vinyl end groups had the best performances, especially high glass transition temperature (about 230°C), the thermal conductivity was 0.32–0.38 Wm−1 K−1, low dielectric constant (about 2.5) and low dielectric loss (about 4.4 × 10−3). The possible reason was that the main chain of polyphenylene ether contains non‐polar crosslinkable group (CC). In a word, through properties comparison of thermosets of PPE, the results demonstrated that the materials of all systems were suitable for using as printed circuit boards.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%