2014
DOI: 10.1039/c4ra02769h
|View full text |Cite
|
Sign up to set email alerts
|

Preparation, characterization and properties of amine-functionalized silicon carbide/polyimide composite films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

1
14
0

Year Published

2015
2015
2024
2024

Publication Types

Select...
9

Relationship

2
7

Authors

Journals

citations
Cited by 27 publications
(15 citation statements)
references
References 44 publications
1
14
0
Order By: Relevance
“…The FTIR absorption spectrum of the SiC sample contains two intense peaks with absorption maxima at 900 cm −1 and 1067 cm −1 , corresponding to the stretching vibrations of the Si–C and Si–O bonds, respectively [23]. This indicates the formation of an amorphous SiO 2 shell on the surface of SiC nanoparticles, which does not appear on the diffraction patterns of the samples.…”
Section: Resultsmentioning
confidence: 99%
“…The FTIR absorption spectrum of the SiC sample contains two intense peaks with absorption maxima at 900 cm −1 and 1067 cm −1 , corresponding to the stretching vibrations of the Si–C and Si–O bonds, respectively [23]. This indicates the formation of an amorphous SiO 2 shell on the surface of SiC nanoparticles, which does not appear on the diffraction patterns of the samples.…”
Section: Resultsmentioning
confidence: 99%
“…The surface modifications of metal oxide NPs by silane coupling agents improve the compatibility of NP surface (hydrophilic) with a hydrophobic polymer surface. Also increases the dispersion stability in organic media [88,89]. PEG, amino, vinyl and phenyl are some of the popular functional groups at the other end of these silane coupling agents.…”
Section: Silanesmentioning
confidence: 99%
“…Currently, polyimide (PI) has been attracting much attention due to its excellent thermal stability, mechanical properties and low electrical conductivity. However, PI has a low thermal conductivity coefficient ( k = 0.18 W/m K), limiting its wide application in devices requiring high thermal conductivity …”
Section: Introductionmentioning
confidence: 99%