Preparation and unique dielectric properties of nanoporous materials with well-controlled closed-nanopores

Abstract

Although general porous materials have a low dielectric constant, their uncontrollable opened porous structure results in high dielectric loss and poor barrier properties, thus limiting their application as interconnect dielectrics. In this study, polymeric nanoporous materials with well-controlled closed pores were prepared by incorporating polystyrene (PS) hollow nanoparticles into polyethylene (PE/HoPS). SEM images suggested a closed porous structure for PE/HoPS. In order to show the effect of the porous structure on dielectric properties, nanoporous materials with an opened or uncontrollable porous structure were prepared by etching SiO2/PE or PE/PS@SiO2 composites. PE/HoPSs composites showed an apparently lower dielectric constant and loss compared with the opened porous PE, demonstrating the advantages of a closed porous structure upon enhancing low-dielectric performance. The low dielectric performance of the PE/HoPS composites is linked with high water resistance owing to their closed porous characteristics. When incorporating 15.3 wt% HoPS (porosity: ∼6.9%), the dielectric constant reached 2.08. This value is lower than that calculated from the serial model. Our work revealed that the incorporation of HoPS not only reduces the porosity, but also alters the intrinsic properties of PE, as a result, leading to a greatly reduced dielectric constant.

A novel nanocomposite of NH2‐MIL‐125 modified bismaleimide‐triazine resin with excellent dielectric properties

“…The Debye equation (formula ) was usually used to analyze the dielectric properties of nanocomposites 39 …”

Honeycomb‐Patterned Polyimide Film as a Versatile Coating for High‐Performance Dielectric Material

“…For the application of low‐dielectric‐constant materials in the microelectronics industry, low dielectric loss, which is necessary for long device lifetimes, is also important, but it is a quality that is usually ignored. As revealed in the literature, the introduction of pores into the polymer film could effectively reduce the dielectric constant but increase the dielectric loss owing to the generation of a heterogeneous structure or impurities . Therefore, controlling the structure of a porous SPI film to optimize the dielectric constant and loss is of considerable importance.…”

“…As revealed in the literature, the introductiono fp ores into the polymerf ilm could effectively reduce the dielectric constant but increase the dielectric loss owing to the generation of ah eterogeneous structure or impurities. [33] Therefore, controlling the structure of aporousSPI film to optimize the dielectric constant andl oss is of considerable importance.T he dielectric properties of the PI film coated with the honeycomb-patterned porousS PI film with different structures were obtained by means of dielectric testinga nd are presented in Figure 3. Compared to the flat PI and SPI films, the dielectric constants of all the composite films apparently decreasedo ver af requency range of 0.1 to 10 7 Hz.…”

From Magneto-Dielectric Biocomposite Films to Microstrip Antenna Devices

“…It is also interesting to mention that the better the NPs dispersion into composite, the greater the number of matrix-fill interfaces, and the greater the dielectric constant [45]. Furthermore, the filling agglomeration generates porous regions that easily trap moisture and increase undesired dielectric losses [46]. Another relevant advantage, considering the use of colloidal dispersions, is the apparently increase of mechanical strength resistance of the film towards fracture and high flexibility, even with high proportion of SPIONs in composite composition.…”