2008
DOI: 10.1002/mawe.200800322
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Preparation and thermal properties of zirconium tungstate/copper composites

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Cited by 18 publications
(9 citation statements)
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“…Most of the metal composite work focused on Cu composites [49,50,186,187,188,189,190]. Cu is used as a heat sink in microelectronics, and copper composites that match the expansion coefficient of Si (4 × 10 −6 K −1 ) or Al 2 O 3 (7 × 10 −6 K −1 ) could find widespread applications [49].…”
Section: Compositesmentioning
confidence: 99%
See 1 more Smart Citation
“…Most of the metal composite work focused on Cu composites [49,50,186,187,188,189,190]. Cu is used as a heat sink in microelectronics, and copper composites that match the expansion coefficient of Si (4 × 10 −6 K −1 ) or Al 2 O 3 (7 × 10 −6 K −1 ) could find widespread applications [49].…”
Section: Compositesmentioning
confidence: 99%
“…It was found that the copper matrix exerts a pressure of ~0.45 GPa on the filler particles [ 187 , 189 ], which is high enough to induce the cubic to orthorhombic phase transition. Attempts to reduce the local stress through precoating of particles with Cu did not succeed in suppressing the transformation [ 190 ]. It should be possible to overcome this problem by using HfW 2 O 8 as a filler instead of ZrW 2 O 8 , however, no such attempts have been reported to date.…”
Section: Compositesmentioning
confidence: 99%
“…Because of the advantage of invariable length with temperature, the ZTE (Zr,Nb)­Fe 2 materials can be used in the temperature-sensitive instruments. To reduce the coefficient of thermal expansion, metal matrix composites (MMCs) are often fabricated, such as Al/Y 2 Mo 3 O 12 , Al/Cu 2 V 2 O 7 , Cu/PbTiO 3 , and Cu/ZrW 2 O 8 . , It is known that inorganic NTE compounds show relatively poor mechanical properties. The present NTE (Zr,Nb)­Fe 2 materials will be beneficial to obtain low thermal expansion composite materials with good comprehensive mechanical and physical properties.…”
mentioning
confidence: 99%
“…In recent years, the composites with controllable thermal expansion have been fabricated by mixing ZrW 2 O 8 with some PTE materials, such as Al [12], Cu [13], SnO 2 [14], ZrO 2 [15], Zr 2 WP 2 O 12 [16], cement [17] and polyimide [18]. Aluminum has an easy process ability, low density, excellent thermal and electrical conductivity, but the large PTE (22.2 × 10 −6 K −1 ) restricts its application in the field of microelectronics and precision instruments.…”
Section: Introductionmentioning
confidence: 99%