Preparation and properties of three‐dimensional boron nitride submicron tube/epoxy resin composites with high thermal conductivity

Wang, Jilin; Li, Zhengde; Chen, Wenzhuo; Xuan, Weiping; Li, Wenbiao; Li, Shaofei; Ji, Yuchun; Zheng, Guoyuan; Long, Fei

doi:10.1002/pc.27335

Cited by 7 publications

(3 citation statements)

References 47 publications

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“…Excellent 3D fillers can minimize the interfacial contact of fillers and have higher heat conduction efficiency per unit mass than randomly dispersed filler systems. [ 173 , 174 , 175 ]. They are expected to maximize the TC of composites with minimal loading [ 176 ], which is also an important direction for the design of highly thermally conductive composites.…”

Section: The Development Of Thermal Conduction Network Of H-bnmentioning

confidence: 99%

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Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

Meng,

Yang,

Jiang

et al. 2024

Nanomaterials

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With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

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Section: The Development Of Thermal Conduction Network Of H-bnmentioning

confidence: 99%

“…Excellent 3D fillers can minimize the interfacial contact of fillers and have higher heat conduction efficiency per unit mass than randomly dispersed filler systems. [173][174][175]. They are expected to maximize the TC of composites with…”

Section: Three-dimensional (3d) Fillersmentioning

confidence: 99%

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

Meng,

Yang,

Jiang

et al. 2024

Nanomaterials

View full text Add to dashboard Cite

show abstract

“…However, many current reports on the enhancement of thermal conductance rely on the high proportion of fillers, leading to the high dielectric loss of the composites. The strong binding force between the contiguous BN sheets and their incompatibility with most of the polymer matrix lead to the stacking of fillers and many voids in the composite film, which is attributed to its interfacial polarization and phonon scattering 21 . Although the surface functionalization of filler can reduce the dielectric loss through inhibiting the interfacial polarization, it also causes partial damage to the crystal structure of the fillers, hence affecting the thermal conductance of composites.…”

Section: Introductionmentioning

confidence: 99%

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Zhang,

Wang,

et al. 2024

Polymer Composites

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Thermally conductive polymeric composites with low dielectric constant are highly promising for the packaging materials in the field of modern communication. Therefore, the synergistic improvement of low dielectric constant and high thermal conductivity has become a current research hotspot. In this work, we propose a one‐step alkylation of boron nitride nanosheet (BNNS) with ultrasonic stratification using 1‐hexanol, and then hot press the films to make Alkyl‐BNNSs orient in the fluorinated polyimide (f‐PI). The resulting Alkyl‐BNNS/f‐PI composite successfully realizes the synergistic improvement of thermal property and dielectric properties, exhibiting a high heat conductivity coefficient of 2.36 Wm−1 K−1 with a filler content of 4.99 wt.%. Moreover, the permittivity and dielectric loss of the film are as low as 1.76 and 0.0065 at 1 MHz, respectively. This work provides a facile strategy for breaking the bottleneck of making polyimide composites simultaneously with high thermal conduction and low dielectric performance.Highlights The composite exhibits a high heat‐conducting coefficient of 2.36 Wm−1 K−1. Ultra‐low dielectric constant of 1.76 was achieved by the modification of film. Excellent breakdown resistance and flexibility were endowed with the composites.

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Flexible and thermally conductive epoxy‐dispersed liquid crystal composites filled with functionalized boron nitride nanosheets

Huang

et al. 2023

Polymer Composites

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In view of the problem of heat accumulation in electronic devices, the development of new composites with high thermal conductivity (TC) is the current research focus. Nowadays, improving TC often lead to inevitable deterioration of the mechanical properties of materials. In this work, the E‐functionalized boron nitride nanosheets (f‐BNNS)/liquid crystal monomer (LCM)/Epoxy‐thiol films with high TC were prepared by using flexible epoxy‐thiol polymer as matrix and LCM and f‐BNNS as thermal fillers via high voltage orientation molding. The epoxy‐thiol polymer possessed high intrinsic TC due to the regular arrangement of molecular chains and the f‐BNNS showed favorable dispersibility because of the modification by isopropyl tri(dioctylpyrophosphate) titanate (ITDPT). The results show that TC of E‐f‐BNNS/LCM/Epoxy‐thiol films with 30 wt% f‐BNNS content achieves 1.65 W/m·K and is 511.11% higher than that of pure epoxy‐thiol polymer (0.27 W/m·K). The tensile strength and elongation at break increase to 24.9 MPa and 47.41%, respectively. The favorable results are attributed to the ordered arrangement of f‐BNNS and molecular chains, resulting from the hydrogen‐bonding interaction between OH group in f‐BNNS, LCM and epoxy‐thiol polymer. This research provides a simple and feasible method for preparing flexible epoxy polymer films with high TC.Highlights The functional BNNS was achieved by isopropyl tri(dioctylpyrophosphate) titanate. Effects of matrix thermal conductivity on films thermal conductivity are probed. High voltage orientation molding are used for preparing epoxy composite films. The films demonstrate excellent thermal conductivity and favorable tensile strength.

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Preparation and properties of three‐dimensional boron nitride submicron tube/epoxy resin composites with high thermal conductivity

Cited by 7 publications

References 47 publications

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Flexible and thermally conductive epoxy‐dispersed liquid crystal composites filled with functionalized boron nitride nanosheets

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