2009
DOI: 10.1088/0022-3727/42/13/135417
|View full text |Cite
|
Sign up to set email alerts
|

Preparation and properties of thin amorphous tantalum films formed by small e-beam evaporators

Abstract: Large area (A = 6 cm 2), thin tantalum films (5 nm < d < 100 nm) are accomplished by evaporation from tantalum rods using small pocket e-beam evaporators. Using a sample to source distance of ≈20 cm, homogeneous amorphous films with a small surface roughness (<1 nm) can be prepared on glass. Films are characterized by scanning electron microscope images, atomic force microscopy, electrochemical oxidation and resistivity measurements as a function of film thickness. The samples show high resistivities of 200-20… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

1
22
0
1

Year Published

2010
2010
2020
2020

Publication Types

Select...
10

Relationship

1
9

Authors

Journals

citations
Cited by 35 publications
(24 citation statements)
references
References 47 publications
1
22
0
1
Order By: Relevance
“…The very low evaporation rates achievable with the mini e-gun are desirable especially for ultra-thin film applications. 17 A total Hf thin film thickness of 50 nm was obtained on a 40 × 40 mm 2 substrate. The base pressure of the e-beam chamber was 5 × 10 −7 Pa and the Hf deposition took place in vacuum (10 −6 Pa) at room temperature.…”
Section: Methodsmentioning
confidence: 99%
“…The very low evaporation rates achievable with the mini e-gun are desirable especially for ultra-thin film applications. 17 A total Hf thin film thickness of 50 nm was obtained on a 40 × 40 mm 2 substrate. The base pressure of the e-beam chamber was 5 × 10 −7 Pa and the Hf deposition took place in vacuum (10 −6 Pa) at room temperature.…”
Section: Methodsmentioning
confidence: 99%
“…The effective thickness of the metallic nanostripe that allowed the best fit was 12 nm. This means that either some of the Ta in contact with the SiO 2 substrate is oxidized and/or that the Ta became very resistive as a thin layer [23]. Figure 2(a) shows small deviations between simulations and experiments for the largest voltage pulses.…”
Section: B Details Of the Computer Simulationsmentioning
confidence: 96%
“…The resistivity of these thin films is 209 μΩcm (10 nm) and 193 μΩcm (15 nm) at room temperature. Moreover, it shows a negative temperature coefficient of resistance (TCR) [43], which is characteristic of high-resistivity disordered metals and has been reported for the β-Ta phase [20,44] and the amorphous Ta as well [21,22]. We inject a charge current from the Py electrode to the left side of the Cu channel.…”
mentioning
confidence: 99%