Preparation and properties of polyimide/aluminum nitride composites

Xie, Shu-Hui; Zhu, Bo; Li, Ju-Biao; Wei, Xiuzhen; Xu, Zuhua

doi:10.1016/j.polymertesting.2004.03.005

Cited by 140 publications

(63 citation statements)

References 18 publications

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“…This is the case with polyvinylidene fluoride when introduced with impurities chlorotrifluoroethylene. [5] Indeed several works have been performed on polymers like polyimide with added Al2O3, BaTiO3 and ZrO3 'impurities' [6,7,8] which showed an improved dielectric constant. Once there is large charge storage, it can be readily released on demand.…”

Section: Application Of Polymeric Dielectric Materialsmentioning

confidence: 99%

Polymer Dielectric Materials

Ahmad¹

2012

Dielectric Material

158

144

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Section: Application Of Polymeric Dielectric Materialsmentioning

confidence: 99%

Polymer Dielectric Materials

Ahmad¹

2012

Dielectric Material

158

144

View full text Add to dashboard Cite

“…In thermal applications, the often low thermal conductivity of the polymeric matrix is typically increased by dispersing in the host matrix inorganic fillers, such as aluminium nitride (AlN) [1,2], boron nitride (BN) [3] and carbon nanotubes [4], or more specifically, ceramic fillers, such as aluminum oxide (Al2O3) [5]. Another way is to design a new material where the material orientation is controlled [6,7].…”

Section: Introductionmentioning

confidence: 99%

Effect of volume-fraction dependent agglomeration of nanoparticles on the thermal conductivity of nanocomposites: Applications to epoxy resins, filled by SiO2, AlN and MgO nanoparticles

Machrafi

Lebon

Iorio

2016

Composites Science and Technology

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Abstract.A thermodynamic model for transient heat conduction in ceramic-polymer nanocomposites is proposed. The model takes into account particle's size, particle's volume fraction, and interface characteristics with emphasis on the effect of agglomeration of particles on the effective thermal conductivity of the nanocomposite.The originality of the present work is its basement on extended irreversible thermodynamics, combining nano-and continuum-scales without invoking molecular dynamics. The model is compared to experimental data using the examples of SiO2, AlN and MgO nanoparticles embedded in epoxy resin. The analysis is limited to spherical nanoparticles. The dependence of the degree of agglomeration with respect of the volume fraction of particles is also discussed and a power-law relation is established through a kinetic mechanism and experiments performed in our laboratory. This relation is used in 2 our theoretical model, resulting into a good agreement with experiments. It is shown that the effective thermal conductivity may either increase or decrease with the degree of agglomeration.

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“…This result can be attributed to the good dispersion state of the filler in the polymer matrix which slowed down the diffusion volatile and degradation process. Therefore, increase the movement restriction of the epoxy matrix because the composite system requires higher thermal energy to degrade [17,18]. Among all the composites shown in Fig.…”

Section: Thermogravimetric Analysis (Tga)mentioning

confidence: 99%

Dielectric and thermal properties of CCTO/epoxy composites for embedded capacitor applications: mixing and fabrication methods

Saidina

Norshamira

Mariatti

2015

J Mater Sci: Mater Electron

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In this study, calcium copper titanate, CaCu 3-Ti 4 O 12 (CCTO) was used as filler in epoxy composite using different mixing and fabrication methods to investigate their suitability as dielectric materials for embedded capacitor. Results show that 20 vol% CCTO/epoxy composite produced using ultrasonic mixing method yield slightly higher dielectric constant, T 5% and T onset as compared to 20 vol% CCTO/epoxy composite produced using agate mortar method. Meanwhile, sample with 20 vol% CCTO/epoxy composite fabricated using spin coating method shows slightly higher dielectric constant, T 5% , T onset and E 0 , and lower CTE value compared to 20 vol% CCTO/epoxy composite fabricated using hot press method. Nevertheless, 40 vol% CCTO/epoxy composite fabricated using hot press method shows the highest dielectric constant, T 5% , T onset and E 0 , and lowest CTE value compared to all composites. In short, composite produced using ultrasonic as mixing method and spin coating as fabrication method are suitable to be utilized to produce epoxy composite as dielectric materials for embedded capacitor applications.

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Preparation and properties of polyimide/aluminum nitride composites

Cited by 140 publications

References 18 publications

Polymer Dielectric Materials

Polymer Dielectric Materials

Effect of volume-fraction dependent agglomeration of nanoparticles on the thermal conductivity of nanocomposites: Applications to epoxy resins, filled by SiO2, AlN and MgO nanoparticles

Dielectric and thermal properties of CCTO/epoxy composites for embedded capacitor applications: mixing and fabrication methods

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