Preparation and polymerization of bismaleimide compounds

Abstract

Bismaleimides with main chains of different structures were prepared by the reaction between maleic anhydride and various diamines and by the reaction between 4-maleimidobenzoylchloride and 3,5-dihidroxybenzoic acid. The monomers were characterized with IR and 1 H-NMR spectroscopy. Polymers based on these compounds were prepared through the Michael addition of diamines to bismaleimides. The thermal characterization of the monomers and polymers was performed with differential scanning calorimetry and dynamic thermogravimetric analysis.

Synthesis, Characterization and Material Application of Poly(Urea-Imide)s, Part 1

“…The bismaleimide monomers were prepared by slight modification of a method reported in the literature [5]. A typical procedure is as follows.…”

Soluble asymmetric bismaleimide with low molten viscosity and its high glass transition temperature polymer

“…Bismaleimide (BMI) is an attractive self‐polymerized thermosetting resin for its outstanding thermal and oxidative stability (high service temperature over 230 °C), flame retardancy, low moisture absorption, good chemical, and corrosion resistance . Owing to the excellent properties, BMI has become an important high performance matrix resin, which is widely applied in microelectronics and aerospace industries, such as multilayer printed circuit boards, semiconductor packaging substrates; advanced composites, high temperature structure adhesives, and potting resins …”

“…Bismaleimide (BMI) is an attractive self-polymerized thermosetting resin for its outstanding thermal and oxidative stability (high service temperature over 230 8C), 1,2 flame retardancy, low moisture absorption, good chemical, and corrosion resistance. 3 Owing to the excellent properties, BMI has become an important high performance matrix resin, which is widely applied in microelectronics and aerospace industries, such as multilayer printed circuit boards, semiconductor packaging substrates 4,5 ; advanced composites, high temperature structure adhesives, and potting resins. 6 The commonly used BMI monomers, such as N,N'-(4,4'-diphenylmethane)bismaleimide (DDM-BMI), have rigid and symmetric molecular structure, which result in some disadvantages of BMI such as high melting temperature, narrow processing temperature window, and poor solubility in the common organic solvents.…”

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

“…Bismaleimide (BMI) resins have excellent properties, such as high temperature resistance, chemical resistance, moisture resistance, high glass transition temperature, and excellent mechanical properties . Therefore, BMI resins can be widely used as advanced composite matrix, wear‐resistant material, high temperature‐resistant insulation material, high‐temperature structural adhesive in aerospace, electronic products, and transportation .…”

“…Inorganic nanoparticles and whiskers are also used as flexibilizers to enhance fracture toughness of BMI resins. In order to enhance the toughness of BMI resins without sacrificing the excellent thermal properties, some long‐chain structure BMI resins are synthesized . These BMI resins showed well performance on the mechanical properties, especially the fracture toughness of the cured resins, without significant reducing the heat resistance of the modified resins …”