Preparation and Performance of Silver Coated Copper Powder

Abstract

Different parameters are used to characterize the conductivity of copper powder with silver plating. Ethanediamine（C2H8N2） is employed to adjust the pH value of plating solution (solution A), and chelate Cu2+ generated by side reaction, forming sound five-membered ring structure with Cu2+, thus preventing the formation of Cu(NH3)42+ which can avoid adsorption of Cu(NH3)42+ on the surface of copper powder. In this way silver-plated copper powder with conductivity equal to fine silver powder can be obtained, the effects of dosage of C2H8N2 and Tollens' reagent concentration on performance of silver-plated copper powder have also been investigated. The result shows that dosage of C2H8N2 has significant effects on electrical conductivity of silver-plated copper powder. The dosage of C2H8N2 should ensure that pH value of control solution A maintains 9.0~10.0. The concentration of Tollens' reagent should make sure that the generated silver-plated copper powder is most even and continuous and tightness when silver particles in form of heterogeneous nucleation is surrounded on the surface of copper powder, , and the optimum concentration is 0.09mol/L. The conductivity of silver-plated copper powder made by Tollens' reagent with 0.09mol/L concentration is optimal, which is 3.9×10-4Ω•cm,when adjusting the pH value of solution A to 9.5 by C2H8N2 control.

Review on Metallization Approaches for High-Efficiency Silicon Heterojunction Solar Cells

“…4e, f) illustrate that the thicknesses of the Sn and Ag coatings on the Cu particles are 1.2 and 0.4 μm, respectively. Sun et al [58] used ethylenediamine as the Ag complexing agent and adjusted the pH value of the plating solution to prepare Ag-coated Cu micronflakes with smooth surfaces. The prepared Ag-coated Cu micronflake powders exhibited a resistivity of 3.9 × 10 −4 Ω•cm.…”

Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste

“…Generally, Cu@Ag powder can be prepared using the galvanic displacement reaction, 30 spray pyrolysis, 13 and electroless plating. [31][32][33] Among these methods, electroless plating allows facile control of the thickness of the Ag shell and is suitable for Cu powders with various shapes. 33,34 Selecting and matching the complexing agent are important in electroless plating because the agent determines the stability of the plating solution, the plating rate, and the properties of the Ag coating.…”

“…[31][32][33] Among these methods, electroless plating allows facile control of the thickness of the Ag shell and is suitable for Cu powders with various shapes. 33,34 Selecting and matching the complexing agent are important in electroless plating because the agent determines the stability of the plating solution, the plating rate, and the properties of the Ag coating. 35,36 Although ammonium hydroxide is commonly used as a complexing agent for electroless Ag plating onto Cu powders (Table S1 †), 31,32,34,[37][38][39][40][41] the stability of the cuprammonium complex and Ag-ammine complex is unsatisfactory.…”