Preparation and performance of low‐dielectric benzocyclobutene resins containing dicyclopentadiene

Wu, Song; Peng, Qiuxia; Deng, Yueting; Shi, Qingyu; Ma, Jiajun; Huang, Yawen; Yang, Junxiao

doi:10.1002/vnl.21913

Cited by 10 publications

(8 citation statements)

References 52 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Dielectric properties of polymer matrix composites are an important and useful indicator 63,64 . Figure 6A shows the mass fraction of BNNS affecting the dielectric permittivity ( ε ) and dissipation factor (tan δ ) values of the PEN/BCB thermally conductive composites.…”

Section: Resultsmentioning

confidence: 99%

“…Dielectric properties of polymer matrix composites are an important and useful indicator. 63,64 Figure 6A shows the mass fraction of BNNS affecting the dielectric permittivity (ε) and dissipation factor (tanδ) values of the PEN/BCB thermally conductive composites. It is clearly seen that ε gradually increases but the tanδ decreases as the loadings increase, which is due to the high ε filler compared to the matrix resin.…”

Section: Dielectric Properties Of Pen/bcb/ Bnns Composite Filmsmentioning

confidence: 99%

See 1 more Smart Citation

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Dielectric Properties Of Pen/bcb/ Bnns Composite Filmsmentioning

confidence: 99%

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

show abstract

“…BCB resin has been widely used in microelectronic packaging, special polymer materials, and other fields due to its excellent comprehensive properties such as low dielectric constant, chemical stability, and suitability for mass production due to its high crosslinking density. [165,166] For POSS-modified reinforced BCB resin, the simple strategy of hydrosilylation reaction is favored by people. [167,168] BCB-POSS composites with two different mechanisms of radical crosslinking of methacrylic acid and diazidenitro insertion were prepared by hydrosilylation reaction HAYES et al [169] and Hu et al [170] synthesized two novel BCB functionalized double-layer POSS monomers (2BCB-DDSQ and 4BCB-DDSQ) by hydrolysis condensation and hydrosilylation.…”

Section: Benzocyclobutene Resinsmentioning

confidence: 99%

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

View full text Add to dashboard Cite

This study provides a comprehensive overview of the preparation methods for polyhedral oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It focuses on the latest advancements in using POSS to design polymer nanocomposites with reduced dielectric constants. The study emphasizes exploring the potential of POSS, either alone or in combination with other materials, to decrease the dielectric constant and dielectric loss of various polymers, including polyimides, bismaleimide resins, poly(aryl ether)s, polybenzoxazines, benzocyclobutene resins, polyolefins, cyanate ester resins, epoxy resins, and more. Additionally, the research investigates the impact of incorporating POSS on improving the thermal properties, mechanical properties, surface properties, and other aspects of these polymers. The entire study is divided into two parts, discussing systematically the role of POSS in reducing dielectric constants during the preparation of POSS composites using both physical blending and chemical synthesis methods. The goal of this research is to provide valuable strategies for designing a new generation of low dielectric constant materials suitable for large‐scale integrated circuits in the semiconductor materials domain.This article is protected by copyright. All rights reserved

show abstract

“…If the heat cannot be effectively eliminated, the accumulated heat will lead to thermal failure, performance degradation, and service life loss of the electronic devices 4,5 . In addition, resistance‐capacity (RC) delay and power dissipation are another bottleneck of electronic devices 6 . These problems are worse at high frequencies 7,8 .…”

Section: Introductionmentioning

confidence: 99%

Regulating surface energy and establishing covalent bonds to enhance interface interaction between m‐BN and polyphenylene oxide for 5G applications

Liao,

Ruan,

Zhang

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

Incorporation of boron nitride (BN) into polymers is a promising method to obtain composites with high thermal conductivity, low dielectric constant (Dk), and dielectric loss (Df), while the practical applications are limited by the poor interface between BN and polymer because of surface energy mismatch and absence of covalent bond connection between them. Herein, polydopamine (PDA) with good adhesion is deposited onto the BN. Then, a different amount of silane coupling agent containing vinyl reactive groups is grafted onto PDA‐coated BN. In this way, the surface energy of modified BN (m‐BN) can be adjusted to ensure BN contacts well with polymers. Moreover, reactive groups were introduced on BN for further reaction. Subsequently, covalent bonds between the m‐BN and the polyphenylene oxide (PPO) were established in situ during the curing process. The effects of the m‐BN surface energy on interface quality and thermal conductivity of composites are investigated. The m‐BN/PPO composite achieves a through‐plane thermal conductivity of 5.87 W/m·K and a low Df value of 1.53 × 10−3, as well as a low coefficient of thermal expansion (CTE) value (7.8 ppm/K) when the m‐BN loading is 32.6 vol%. This research provides a simple and efficient strategy for fabricating high‐performance composites for high‐frequency applications.Highlights Hexagonal boron nitride was modified successfully by combining non‐covalent and covalent modifications. Regulating surface energy and establishing covalent bonds enhances interface interaction between BN and polyphenylene oxide. Modified BN/polyphenylene oxide composites display improvements in thermal conductivity and dimensional stability as well as dielectric loss. Provides a feasible strategy for designing polymer composites with high thermal conductivity, dimensional stability, and low dielectric loss for 5G applications.

show abstract

Preparation and performance of low‐dielectric benzocyclobutene resins containing dicyclopentadiene

Cited by 10 publications

References 52 publications

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Regulating surface energy and establishing covalent bonds to enhance interface interaction between m‐BN and polyphenylene oxide for 5G applications

Contact Info

Product

Resources

About