2014
DOI: 10.1039/c4tc00509k
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Preparation and oxidation behavior of Ag-coated Cu nanoparticles less than 20 nm in size

Abstract: This study examines the oxidation behavior of Ag-coated Cu (Cu@Ag) nanoparticles (NPs) less than 20 nm in size synthesized using a solvothermal method and an immersion process with varying Ag shell quality. The anti-oxidation property of Cu@Ag NPs was strongly dependant on the Ag shell quality.

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Cited by 51 publications
(29 citation statements)
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“…[1][2][3][4][5] However, pure Cu particles gradually oxidize in air, and the resulting oxide coatings increase the sintering temperature and degrade the conductivity. [6][7][8] To solve these critical problems, Ag has been proposed recently as a passivation material to be coated on the Cu particle surface, and a number of studies on the fabrication of Ag-coated Cu (Cu@Ag) particles have been carried out. [8][9][10] Given the trend toward increasingly smaller electrodes, the line width of conductive paste regions in printed bezel electrodes has decreased to values below 50 µm, and the size of filler particles such as Cu@Ag particles has been reduced to several micrometers.…”
Section: Introductionmentioning
confidence: 99%
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“…[1][2][3][4][5] However, pure Cu particles gradually oxidize in air, and the resulting oxide coatings increase the sintering temperature and degrade the conductivity. [6][7][8] To solve these critical problems, Ag has been proposed recently as a passivation material to be coated on the Cu particle surface, and a number of studies on the fabrication of Ag-coated Cu (Cu@Ag) particles have been carried out. [8][9][10] Given the trend toward increasingly smaller electrodes, the line width of conductive paste regions in printed bezel electrodes has decreased to values below 50 µm, and the size of filler particles such as Cu@Ag particles has been reduced to several micrometers.…”
Section: Introductionmentioning
confidence: 99%
“…[6][7][8] To solve these critical problems, Ag has been proposed recently as a passivation material to be coated on the Cu particle surface, and a number of studies on the fabrication of Ag-coated Cu (Cu@Ag) particles have been carried out. [8][9][10] Given the trend toward increasingly smaller electrodes, the line width of conductive paste regions in printed bezel electrodes has decreased to values below 50 µm, and the size of filler particles such as Cu@Ag particles has been reduced to several micrometers. [11] Moreover, if the printed patterns of conductive paste in the bezel electrodes are required to become even narrower, the particle size must be reduced to approximately one micrometer or less.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Apart from the pure enhancement of activity, dimetallic nanoparticles allow us to tune the activity reaction specifically through composition ratios and morphology tailoring. [1][2][3] Apart from the pure enhancement of activity, dimetallic nanoparticles allow us to tune the activity reaction specifically through composition ratios and morphology tailoring.…”
Section: Introductionmentioning
confidence: 99%
“…However, pure Cu powders gradually oxidize in air at room temperature [4][5][6][7] and the oxidation accelerates with increasing temperature [8,9]; thus, the fabrication and application of Ag-coated Cu (Cu@Ag) powders to suppress the surface oxidation of Cu powders has recently attracted more attention [4][5][6][7][8]10,11]. As pitches for interconnections have become increasingly narrow [12], the fabrication of filler metal powders with diameters of several micrometers, including Cu@Ag powders, will become more important.…”
Section: Introductionmentioning
confidence: 99%