“…Growth at high substrate temperature to overcome the kinetic barrier to oxidation is not an option for two reasons: (1) the rapid interdiffusion of VO 2 into the underlying substrates [50,52,54] and (2) if the entire film is oxidized to V 2 O 5 , it will all evaporate due to the high vapor pressure of V 2 O 5 . [55] Despite the many challenges involved in the growth of VO 2 films, significant advances have been achieved in its deposition using PLD, [42,[56][57][58][59][60][61][62][63] MBE, [52,53,64,65] sputtering, [66][67][68][69][70][71][72][73] electronbeam deposition, [74] ion-beam depostion, [75] metalorganic [48,49] (c) Resistivity versus temperature for various V-O phases, with a MIT at different temperatures. While V 2 O 3 exhibits the largest change in resistivity over eight orders of magnitude, but below room temperature, VO 2 has the largest resistivity ratio above room temperature of about five orders of magnitude.…”