2021
DOI: 10.3791/62351-v
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Preparation and Cryo-FIB micromachining of <em>Saccharomyces cerevisiae</em> for Cryo-Electron Tomography

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“…20 x 0.2 µm² stress-relief trenches were made with a current of 1.5 nA (Wolff et al, 2019). To remove ice contamination or re-deposition that occurred during the milling procedure, a polishing step was performed (Moravcová et al, 2021). To our experience, polishing should be performed less than 2-3 h before the lamellae are retrieved from the SEM chamber in order to limit re-deposition and fully benefit from the fine milling.…”
Section: Cryo-fibm/sem Workflowmentioning
confidence: 99%
“…20 x 0.2 µm² stress-relief trenches were made with a current of 1.5 nA (Wolff et al, 2019). To remove ice contamination or re-deposition that occurred during the milling procedure, a polishing step was performed (Moravcová et al, 2021). To our experience, polishing should be performed less than 2-3 h before the lamellae are retrieved from the SEM chamber in order to limit re-deposition and fully benefit from the fine milling.…”
Section: Cryo-fibm/sem Workflowmentioning
confidence: 99%