Preparation and conductive property of Cu coatings and Cu-graphene composite coatings on ABS substrate

Abstract

A facile, low-cost and environmentally-friendly technique has been developed to prepare highly conductive copper-graphene nanosheet (Cu-GNS) composite coatings on ABS (Acrylonitrile-Butadiene-Styrene) substrate. The surface activation of ABS substrate was obtained by a chrome-free and palladium-free pretreatment consisting of molecular bonding. Before electroplating Cu, the homogeneous single Ag film on ABS surface was achieved by the electroless spray-plating process. In addition, the deposition of Cu and GNS increased in the coatings along with the current density increasing. Four-point-probe test confirmed that the resistivity of Cu coatings (0.08 mΩ mm) and Cu-GNS composite coatings (0.05 mΩ mm) was in the same order of magnitude as pure copper (0.0175 mΩ mm) at high current density. Meanwhile, comparing with the Cu coatings, the resistivity of Cu-GNS composite coatings was reduced by nearly 40% at the same current density. The conductive property was significantly improved owing to the deposition of GNS. Therefore, this work was expected to expand the method of polymer materials surface metallization.

Copper nanoparticle decorated non-woven polypropylene fabrics with durable superhydrophobicity and conductivity

“…Figures 7(a) and (b) display the morphology of PP fabrics before and after drying, both of them possessed the coral-like micro-nano hierachical structures. In addition, As shown in figure 7(c), the XRD patterns of fabrics before and after drying exhibited similar characteristic peaks at 43.32 • , 50.45 • , 74.12 • , which correspond to (111), (200), and (220) phases of pure metallic copper respectively [38].…”

Electroless Metallization of the Elements: Survey and Progress

“…Ag film thickness is built up by repeated spraying passes. The resulting Ag films exhibit lower oxide levels and improved electrical conductivity, modulus, and hardness than those prepared by conventional dipcoating deposition and are sufficiently adherent to function as electrodes for Cu electrodeposition …”

“…The resulting Ag films exhibit lower oxide levels and improved electrical conductivity, modulus, and hardness than those prepared by conventional dipcoating deposition 529 and are sufficiently adherent to function as electrodes for Cu electrodeposition. 530 Jiang and co-workers 82 report an analogous system in which separate ammoniacal Ag I and glucose solutions are mixed in a print head and inkjet printed onto PI surfaces bearing aldehyde/ketone groups formed via O 2 plasma oxidation. EL Ag deposition occurs to form an adherent, flexible, electrically conductive film stable to 600 °C for wearable electronics and shielding applications after a thermal anneal at 80 °C for 2 h. More recently, Rosker and co-workers 531 53 process, as well as CuNiPdAu films prepared via the related ENEPIG process 360 briefly discussed in the Palladium section.…”

“…Spraycoating represents another means to scale-up EL Ag plating. In this regard, Kang and co-workers , have been developing SAM-based methods for Ag plating ABS substrates. They exploit the UV azide chemistry of 6-(3-triethoxysilyl-propylamino)-1,3,5-triazine-2,4-azide (P-TES) to form a P-TES SAM on the ABS surface.…”

Fabrication of highly conductive, flexible, and hydrophobic Kevlar®@Ni–P–B@Cu@CS fabric with excellent self-cleaning performance for electromagnetic interference shielding

“…41,42 Their loading methods include chemical or physical vapor deposition 40,43,44 and electroless plating. 35,45 Electroplating 46,47 can also be conducted when the textile has been endowed with the necessary electrical conductivity. Among these loading methods, electroless plating is considered a highly efficient method for creating homogenous coatings over nonconductive substrates with complex shapes owing to its advantages of simple equipment, easy operation, and high efficiency.…”