Preparation and Characterization of Transparent Polyimide Nanocomposite Films with Potential Applications as Spacecraft Antenna Substrates with Low Dielectric Features and Good Sustainability in Atomic-Oxygen Environments

Abstract

Optically transparent polyimide (PI) films with good dielectric properties and long-term sustainability in atomic-oxygen (AO) environments have been highly desired as antenna substrates in low earth orbit (LEO) aerospace applications. However, PI substrates with low dielectric constant (low-Dk), low dielectric dissipation factor (low-Df) and high AO resistance have rarely been reported due to the difficulties in achieving both high AO survivability and good dielectric parameters simultaneously. In the present work, an intrinsically low-Dk and low-Df optically transparent PI film matrix, poly[4,4′-(hexafluoroisopropylidene)diphthalic anhydride-co-2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane] (6FPI) was combined with a nanocage trisilanolphenyl polyhedral oligomeric silsesquioxane (TSP-POSS) additive in order to afford novel organic–inorganic nanocomposite films with enhanced AO-resistant properties and reduced dielectric parameters. The derived 6FPI/POSS films exhibited the Dk and Df values as low as 2.52 and 0.006 at the frequency of 1 MHz, respectively. Meanwhile, the composite films showed good AO resistance with the erosion yield as low as 4.0 × 10−25 cm3/atom at the exposure flux of 4.02 × 1020 atom/cm2, which decreased by nearly one order of magnitude compared with the value of 3.0 × 10−24 cm3/atom of the standard PI-ref Kapton® film.

Graphene/Polyimide Composite Aerogels for Superior Electromagnetic-Wave-Absorbing Materials with High Thermal Stability and Absorption Effectiveness

“…To verify the chemical structure transformation of polymers, PAA, pristine PAAS, pristine PAAS treated at 180 °C for 12 h [PAAS (180)], and GPI 1 and GPI 1 (350) were measured by FTIR, and the curves are shown in Figure a. The FTIR spectrum of PAA consists of peaks at 1720 cm –1 (υ s of CO in imide rings), 1620 cm –1 (υ C–N and υ N–H in the amide II band), 1380 cm –1 (υ C–N of the aromatic amine group), and 1230 cm –1 (υ Ar–O–Ar of the diphenyl ether). , PAAS shows peaks at 1720, 1620, and 729 cm –1 (δ CO ) . It can be seen that compared with the FTIR spectrum of PAA, the characteristic peak intensity of –COOH at 1720 cm –1 of PAAS decreases dramatically, which is the result of the salt-forming reaction between triethylamine and –COOH, indicating the formation of the PAAS structure.…”

A Comprehensive Review on the Thermal Stability Assessment of Polymers and Composites for Aeronautics and Space Applications

“…Recently, Zhang et al developed transparent PI-based nanomaterials using a fluoro-containing PI and trisilanolphenyl-polyhedral oligomeric silsesquioxanes (TSP-POSS) as additives to improve the resistance to atomic oxygen (AO) degradation [ 57 ]. Different films were prepared, varying the amount of TSP-POSS between 0 and 25 wt%, and they were named 6FPI-0, 6FPI-5, 6FPI-10, 6FPI-15, 6FPI-20, and 6FPI-25 based on the filler content.…”

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

“…Aromatic polyimide films have been widely used in many high-tech fields, including electrical insulation [ 15 , 16 , 17 , 18 , 19 , 20 ], electronic packaging [ 21 , 22 ], and aerospace [ 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 ], due to their excellent combination of thermal, mechanical, and electrical properties. Aromatic polyimide films can be made by casting the polyimide precursor solution–polyamic acid (PAA) on the substrate surface, and then thermally baking it to form a self-supporting gelled film.…”