“…Physical vapor deposition (PVD) methods, including double-discharge plasma deposition [21], magnetron sputtering in radio-frequency discharge [3,22], and direct-current discharge [23] are used for deposition of Ir coatings most widely to date. For stable operation of deposition facility in a double-discharge plasma, it is necessary to set a relatively high negative potential not only of the sputtered Ir cathode (typical values are 800-900 V) but also of the substrates (300-400 V) [21,24]. The energy of ions bombarding the coating in such devices is usually determined by the conditions of stable discharge combustion, and the value of the ion current density directly depends on other operating parameters (electrode potentials, gas pressure).…”