Preparation and characterization of epoxy-silica hybrid materials by the sol-gel process

Preparation and characterization of epoxy–silica networks chemically bonded through aminophenyl-trimethoxysilane

“…The large damping in the tan d curves and increase in T g for the bonded hybrids showing elastic behavior can be attributed to improved adhesion and stiffer inter-phase generated from reaction between amine groups present on APTMOS and DGEBA which helps the polymer chains to get absorbed in the silica network structure thus their motion get restricted. These results are different to the previous findings [16,[20][21][22][23] where the T g in such epoxy hybrids showed a decrease in the T g in addition of silica. Using the solvent like THF, acetone or dioxane in these workers could not overcome the viscosity effects.…”

“…The absorption peak for Si-O-Si asymmetric stretching according to the literature [30] appears in the range 1,000-1,250 cm -1 . The study conducted by Musto et al [31] demonstrates that Si-O-Si absorption appearing at high wave numbers around 1,220-1,250 cm -1 (region a in spectra C) are from the cyclic silica structure where as those appearing at the lower wave number around 1,036-1,085 cm -1 (region b) are for linear silica structures.…”

“…The T g of the resulting hybrids was found to be reduced on addition of silica in the matrix. Lu et al [22] studied epoxy resin partially functionalized by APTES through hydrolysis/condensation of metasilicate salt. The impact strength, tensile strength, T g and thermal effect of the hybrid materials were studied.…”

“…The filler-matrix interface also plays an important role; if the T g of the interface is less than that of the matrix, the T g of the resulting composite may decrease, but if the T g of the interface is higher than that of the matrix, the T g of composite will increase by increasing filler content [29]. The silanes used previously [6,[19][20][21][22][23]27] to compatiblize the organic inorganic phases (e.g., 3-aminopropyl-triethoxysilane, N-(2-aminoethyl)-3-aminopropyl-trimethoxysilane, 3-glycidoxy propyl-trimethoxysilane) had the propyl chain as interface which is considered to be very flexible. We in the present paper have used instead aminophenyl-trimethoxysilane (APTMOS) where the phenyl group acting as inter-phase is more rigid than the propyl chain used previously.…”

Synthesis and electrical characterization of low-temperature thermal-cured epoxy resin/functionalized silica hybrid-thin films for application as gate dielectrics

“…The degradation temperature increased approximately 30°C for the hybrid material. The organoalkoxysilanes (MTMS and PTMS) strengthened the interaction between the epoxy matrix and the silica particles, which caused an increased restricting strength of silica on the epoxy resin such as hydrogen bonding and van der Waals force [10]. The maximum degradation temperature slightly decreased according with silica contents, within 5°C range.…”