2010
DOI: 10.1016/j.apsusc.2010.02.090
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Preferred orientations in nano-gold/silica/silicon interfaces

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Cited by 8 publications
(3 citation statements)
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“…(2) should hold better only for the four samples with a < 25%. Moreover, the series of samples grown at the lower temperature of 100 o C may have particle shapes that deviate from the thermodynamic equilibrium shape, which should be spherical (Vasisht and Shirokoff 2010). Therefore we attempted calculations only for the high deposition temperature samples.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…(2) should hold better only for the four samples with a < 25%. Moreover, the series of samples grown at the lower temperature of 100 o C may have particle shapes that deviate from the thermodynamic equilibrium shape, which should be spherical (Vasisht and Shirokoff 2010). Therefore we attempted calculations only for the high deposition temperature samples.…”
Section: Resultsmentioning
confidence: 99%
“…In our case, the deposition temperature is kept in relatively high values. This allows the particles to take easier their final equilibrium nearly spherical shape (Vasisht and Shirokoff 2010). The deposition temperature is more effective than the same temperature of annealing continuous films; even relatively high deposition temperature allows the sample to obtain the equilibrium shape immediately during deposition without the need to overcome thermodynamic diffusion barriers that may be introduced when a continuous or semi-continuous film is formed at low deposition temperatures.…”
Section: Introductionmentioning
confidence: 99%
“…As FIB patterning and ALD are both applicable for 3D nanofabrication, they can be used for fabrication of a 3D mask. To demonstrate this we used gold particles that were randomly splashed on the sample surface from a molten Au source during Au evaporation [31]. The sample with these 3D gold particles was coated by ALD with the oxide multilayer (sequentially grown 200 nm Al 2 O 3 , 60 nm Ta 2 O 5 and 50 nm Al 2 O 3 ) so that 3D film stacks were conformally formed on the gold particles.…”
Section: Interlayer Metal Connection and Resistor Fabricationmentioning
confidence: 99%