Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling

Al-Duhni, Ghaleb Saleh Ghaleb; Khasgiwala, Mudit; Volakis, John L.; Raj, Pulugurtha Markondeya

doi:10.1109/tcpmt.2024.3401617

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3401617

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Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling

Ghaleb Saleh Ghaleb Al-Duhni,

Mudit Khasgiwala,

John L. Volakis

et al.

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Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling

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References 28 publications

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