2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2018
DOI: 10.1109/edaps.2018.8680882
|View full text |Cite
|
Sign up to set email alerts
|

Preeminent Buffer Insertion Technique For Long Advanced On-Chip Graphene Interconnects

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
2
2
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 7 publications
0
1
0
Order By: Relevance
“…Crosstalk has become the most critical concern in modern sub-10 nm integrated circuits [ 14 ]. This coupling causes problems that can be addressed by various methods like shielding [ 15 , 16 , 17 , 18 , 19 , 20 ], inserting repeaters [ 21 , 22 , 23 , 24 , 25 ] or buffers [ 26 , 27 , 28 , 29 , 30 , 31 ], duplication [ 32 ] and crosstalk avoidance code (CAC) [ 33 , 34 , 35 , 36 ]. Insertion of buffers and shielding has more area cost when compared to duplication or CAC [ 37 ].…”
Section: Introductionmentioning
confidence: 99%
“…Crosstalk has become the most critical concern in modern sub-10 nm integrated circuits [ 14 ]. This coupling causes problems that can be addressed by various methods like shielding [ 15 , 16 , 17 , 18 , 19 , 20 ], inserting repeaters [ 21 , 22 , 23 , 24 , 25 ] or buffers [ 26 , 27 , 28 , 29 , 30 , 31 ], duplication [ 32 ] and crosstalk avoidance code (CAC) [ 33 , 34 , 35 , 36 ]. Insertion of buffers and shielding has more area cost when compared to duplication or CAC [ 37 ].…”
Section: Introductionmentioning
confidence: 99%