Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints

Tunga, Krishna; Sitaraman, Suresh K.

doi:10.1109/tcapt.2009.2032924

Cited by 16 publications

(4 citation statements)

References 22 publications

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“…Typically, three to four cycles are used for the accumulated strain energy density calculation. After three cycles the accumulated strain energy per cycle tends to stabilize (8). Figure 2 shows four cycles of temperature according the described test conditions.…”

Section: Accelerated Thermal Cyclingmentioning

confidence: 99%

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Impact of Mold Properties on the Reliability of Ball Grid Array Packaging

Carpi¹,

Mazon

2011

ECS Trans.

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A fatigue model based on viscoplastic material properties and accumulated plastic work was applied to predict crack initiation and crack propagation on Pb-free solder joints. The fatigue model relies on finite element analysis of Ball Grid array electronic packages and Design of Experiments methodology to explore the impact of mold material properties and thickness on the package reliability. It was observed that the outermost solder joint has the lowest failure free life in agreement with the literature.

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Section: Accelerated Thermal Cyclingmentioning

confidence: 99%

“…Failure is assumed for crack lengths equal to the solder joint diameter. Tunga has shown experimentally that Darveaux's method results in much lower number of cycles for crack initiation (8). Therefore, this procedure is considered more conservative.…”

Section: 86∆mentioning

confidence: 99%

Impact of Mold Properties on the Reliability of Ball Grid Array Packaging

Carpi¹,

Mazon

2011

ECS Trans.

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“…Figure 4 plots the failure rate of product under different temperatures based on equation (26). The curve denotes that the product is more fragile at high temperature, and the point indicates that the temperature where the product has the minimal failure rate is 5°C.…”

Section: Illustrative Examplementioning

confidence: 99%

“…Several researchers proposed models to assess the reliability of the assembly without the need for extensive testing. 25,26 Failure statistics showed that 55% failures of the electronic products are related to their operating thermal environment. 27 There are two common types of failure modes when the electronic devices work in the thermal conditions.…”

Section: Introductionmentioning

confidence: 99%

A reliability assessment method based on an accelerated testing under thermal cycling environment

Ren

Tao

et al. 2014

Proceedings of the Institution of Mechanical Engineers, Part O:

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This article proposes a reliability assessment method based on an accelerated testing under thermal cycling environment to assess the reliability of an electronic device with multiple failure modes. First, two typical failure modes of the electronic devices in the thermal environment are analyzed. It is concluded that the reliability of a complicated electronic device (with both the two typical failure modes) is difficult to assess through the existing accelerated testing methods. Second, an acceleration model is established by combining the Arrhenius model with the Norris-Landzberg model. The influences of the thermal cycling environment on both the typical failures are taken into account in this model. Third, a thermal cycling test plan is developed, and a new approach is proposed to evaluate the reliability of an electronic device with multiple failure modes. Finally, a numerical example is illustrated to demonstrate the feasibility of proposed method, and the calculation results show the efficiency of the proposed method.

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